The **ATS-15B-100-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed for cooling electronic components such as CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the physical and thermal characteristics of the product. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (with springs) | | **Thermal Resistance** | 4.84°C/W (at 100 LFM) | | **Fin Style** | Straight (Mini-Fin) | | **Finish** | Blue Anodized | | **Weight** | ~40 grams | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring compatibility with the PCB layout and surrounding components. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 25.00 mm * **Pitch (between pins):** 38.00 mm --- ### 3. Key Electronic Cooling Features * **pushPIN™ Attachment:** Unlike adhesive tapes, this uses a spring-loaded push-pin mechanism. This ensures consistent pressure (clamping force) between the heat sink and the chip, improving heat transfer efficiency. * **High Performance Interface:** It is typically paired with a Phase Change Material (PCM) or Thermal Interface Material (TIM) to eliminate air gaps between the component and the metal. * **Airflow Optimization:** The "C2" designation refers to specific fin density and geometry designed to provide low pressure drop while maximizing surface area for forced-air cooling. --- ### 4. Typical Applications This specific heat sink is used in environments where electronic components generate significant heat in a compact space: 1. **Telecommunications:** Networking switches and routers. 2. **Power Electronics:** Cooling MOSFETs or IGBTs in power supplies. 3. **Embedded Systems:** Industrial PCs and automation controllers. ---