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  • ATS-15B-13-C2-R0

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    The **ATS-15B-13-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions Inc. It is designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 15.00mm | | **Thermal Resistance (Unducted)** | 13.70 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.82 °C/W @ 100 LFM | | **Fin Type** | XCUT (Fine Pitch) | --- ### 2. Key Electronic & Mechanical Features #### A. pushPIN™ Attachment System This part utilizes a specialized mechanical mounting system. * **Precision Springs:** Provides the exact required pressure to ensure maximum thermal contact between the heat sink and the component. * **Ease of Installation:** Allows for repeatable assembly without the risk of over-tightening or damaging the PCB. #### B. Thermal Performance The "XCUT" fin design increases the surface area available for heat dissipation. In electronics, effective heat sinking is critical for: 1. **Preventing Thermal Throttling:** Ensuring the chip maintains its clock speed. 2. **Extended Lifespan:** Reducing the operating temperature of semiconductors to prevent long-term degradation. #### C. Material Properties The use of **Blue Anodized Aluminum** serves two purposes: * **Corrosion Resistance:** Protects the metal from oxidation. * **Radiative Heat Transfer:** The dark anodized finish slightly improves the emissivity compared to bare aluminum. --- ### 3. Part Number Breakdown The nomenclature for this series follows a specific logic: ```text ATS - 15 B - 13 - C2 - R0 | | | | | | | | | └── Revision Code | | | └─────── Color/Finish (C2 = Blue Anodized) | | └──────────── Height (13 = 15mm approximately) | └─────────────────── Attachment Style (B = pushPIN™) └───────────────────────── Manufacturer (Advanced Thermal Solutions) ```
    ✨ Follow-up Questions
    • ⤷ What are the compatible PCB hole patterns for the pushPIN™ attachment?
    • ⤷ How does the 'Ducted' vs 'Unducted' airflow impact the cooling efficiency?
    • ⤷ Are there alternative thermal interface materials (TIM) recommended for this heat sink?