ATS-15B-13-C2-R0
AI

The **ATS-15B-13-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions Inc. It is designed for cooling electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 15.00mm |
| **Thermal Resistance (Unducted)** | 13.70 °C/W @ 100 LFM |
| **Thermal Resistance (Ducted)** | 1.82 °C/W @ 100 LFM |
| **Fin Type** | XCUT (Fine Pitch) |
---
### 2. Key Electronic & Mechanical Features
#### A. pushPIN™ Attachment System
This part utilizes a specialized mechanical mounting system.
* **Precision Springs:** Provides the exact required pressure to ensure maximum thermal contact between the heat sink and the component.
* **Ease of Installation:** Allows for repeatable assembly without the risk of over-tightening or damaging the PCB.
#### B. Thermal Performance
The "XCUT" fin design increases the surface area available for heat dissipation. In electronics, effective heat sinking is critical for:
1. **Preventing Thermal Throttling:** Ensuring the chip maintains its clock speed.
2. **Extended Lifespan:** Reducing the operating temperature of semiconductors to prevent long-term degradation.
#### C. Material Properties
The use of **Blue Anodized Aluminum** serves two purposes:
* **Corrosion Resistance:** Protects the metal from oxidation.
* **Radiative Heat Transfer:** The dark anodized finish slightly improves the emissivity compared to bare aluminum.
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### 3. Part Number Breakdown
The nomenclature for this series follows a specific logic:
```text
ATS - 15 B - 13 - C2 - R0
| | | | |
| | | | └── Revision Code
| | | └─────── Color/Finish (C2 = Blue Anodized)
| | └──────────── Height (13 = 15mm approximately)
| └─────────────────── Attachment Style (B = pushPIN™)
└───────────────────────── Manufacturer (Advanced Thermal Solutions)
```
- ⤷
What are the compatible PCB hole patterns for the pushPIN™ attachment?
- ⤷ How does the 'Ducted' vs 'Unducted' airflow impact the cooling efficiency?
- ⤷ Are there alternative thermal interface materials (TIM) recommended for this heat sink?