ATS-15B-142-C2-R0
AI

The **ATS-15B-142-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blue ICE" series and is designed for electronic components requiring efficient thermal management, such as BGAs (Ball Grid Arrays).
### 1. Component Specifications
The following table outlines the physical and thermal properties of this specific part:
| Attribute | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-15B-142-C2-R0 |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | 10.07°C/W (at 100 LFM) |
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### 2. Key Features and Materials
The "Electronic Parts" aspect of this component relates to how it interacts with semiconductors and PCB layouts:
* **Thermal Interface Material (TIM):** This specific model typically comes with **T766**, a high-performance thermal pad or grease pre-applied to the base to ensure minimal air gaps between the chip and the heat sink.
* **Push-Pin Attachment:** Unlike adhesive-based heat sinks, the `pushPIN™` system uses a flexible spring-loaded mechanism. This ensures constant pressure for better thermal transfer and allows for secure mounting even in high-vibration environments.
* **Material Science:** The use of **6063 Aluminum** provides a high strength-to-weight ratio and excellent thermal conductivity. The Blue Anodized finish is not just aesthetic; it increases emissivity and provides surface protection against corrosion.
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### 3. Thermal Performance Data
Performance varies based on the airflow (Linear Feet per Minute) within the electronic enclosure:
| Airflow Velocity | 100 LFM (0.5 m/s) | 300 LFM (1.5 m/s) | 500 LFM (2.5 m/s) |
| :--- | :--- | :--- | :--- |
| **Thermal Resistance** | 10.07 °C/W | 5.82 °C/W | 4.64 °C/W |
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### 4. Technical Nomenclature Breakdown
The part number follows a specific logic:
* **ATS:** Advanced Thermal Solutions.
* **15:** Indicates the series or specific design line.
* **142:** Refers to the specific dimensions/footprint configuration.
* **C2:** Indicates the material and finish (Aluminum, Blue Anodized).
* **R0:** Revision code for the product.
- ⤷What are the mounting hole requirements for the pushPIN system on a PCB?
- ⤷ How does blue anodization compare to black anodization in terms of thermal emissivity?
- ⤷ Is this heat sink compatible with standard BGA components of 27x27mm or 31x31mm?