The **ATS-15B-149-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Below are the primary specifications for this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ HS | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 6.21°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm | | **Fin Style** | Fine Pitch (Cross-Cut) | --- ## 2. Key Electronic Features The "electronic" functionality of this part is passive, but its design is critical for electrical system stability: ### A. pushPIN™ Attachment System Unlike adhesive-based heat sinks, the **R0** designation indicates a push-pin mechanism. * **Spring-loaded:** Ensures consistent pressure between the heat sink and the electronic chip. * **Reliability:** Resistant to vibration, making it suitable for automotive or industrial electronics. ### B. Thermal Interface Material (TIM) The part comes pre-applied with **T766** thermal phase change material. * **Function:** Fills microscopic air gaps between the component die and the aluminum base to maximize heat transfer. * **Efficiency:** Eliminates the need for manual application of thermal paste. ### C. Thermal Performance (LFM - Linear Feet per Minute) The efficiency of this part varies based on the airflow within the electronic enclosure: * **@ 100 LFM:** 6.21 °C/W * **@ 400 LFM:** 2.45 °C/W * **@ 700 LFM:** 1.89 °C/W --- ## 3. Applications in Electronics This specific heat sink is typically found in: 1. **Telecommunications:** Cooling of high-speed network switches and routers. 2. **Embedded Systems:** Industrial PCs where space is limited but heat density is high. 3. **Power Supplies:** Cooling MOSFETs or Voltage Regulators (VRMs) that handle high current. --- ## 4. Part Number Breakdown ```text ATS - 15 B - 149 - C2 - R0 | | | | | | | | | └─ Revision/Spring Type | | | └─ Thermal Interface Material (T766) | | └─ Specific Heat Sink Profile (149) | └─ Fin Type/Pitch └─ Advanced Thermal Solutions ```