ATS-15B-152-C2-R0
AI

The **ATS-15B-152-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs.
---
### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Thermal Resistance** | 3.30°C/W (Unducted Flow @ 100 LFM) |
| **Dimensions** | 35mm x 35mm x 25mm |
---
### 2. Design and Component Breakdown
#### A. Fin Profile (Straight Fin)
The "152" in the part number indicates a specific fin pattern. This model uses a **straight fin** design, which is optimized for airflow that moves consistently in one direction. The 25mm height provides a large surface area for heat exchange without excessive vertical bulk.
#### B. Push-Pin Attachment Mechanism
Instead of using messy thermal adhesives or fragile clips, this part uses a **spring-loaded push-pin** system.
* **Performance:** Provides consistent pressure (clamping force) to ensure the thermal interface material (TIM) makes perfect contact with the chip.
* **Hardware:** Features a brass pin and a stainless steel spring for durability and vibration resistance.
#### C. Thermal Interface Material (TIM)
The "C2" suffix typically denotes that the heat sink comes pre-applied with **ATS-54** (a high-performance thermal phase-change material) or a high-performance thermal grease, ensuring low thermal resistance between the component and the aluminum base.
---
### 3. Thermal Performance Metrics
The effectiveness of this part depends on the velocity of the air (measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **100 (0.5 m/s)** | 3.30 |
| **300 (1.5 m/s)** | 1.90 |
| **500 (2.5 m/s)** | 1.50 |
---
### 4. Part Number Breakdown (Decoded)
* **ATS:** Manufacturer (Advanced Thermal Solutions)
* **15:** pushPIN™ Series
* **B:** Aluminum Material
* **152:** Specific Fin Geometry/Size
* **C2:** Thermal Interface Material / Finish Code
* **R0:** RoHS compliant (Standard packaging/revision)
---
- ⤷What is the mounting hole pattern required for this heat sink?
- ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied TIM?
- ⤷ How does the 'Blue Anodized' finish affect thermal radiation performance?