The **ATS-15B-166-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to dissipate heat from high-power electronic components like CPUs, GPUs, and FPGAs. --- ## 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-15B-166-C3-R0 | | **Base Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ (Brass Pin with Spring) | | **Material** | Aluminum (Black Anodized) | | **Thermal Resistance** | 12.30°C/W (Unducted Flow @ 200 LFM) | | **Pressure Drop** | High-performance fin geometry for low resistance | --- ## 2. Physical Dimensions Precision is critical for board layout and component clearance: * **Length:** 25.00 mm * **Width:** 25.00 mm * **Height:** 15.00 mm * **Hole Spacing:** 30.00 mm (center to center) --- ## 3. Key Electronic Design Features ### A. pushPIN™ Attachment System Instead of using messy thermal adhesives or fragile clips, this part uses a **pushPIN™** system. * It consists of a brass pin and a stainless steel spring. * This ensures a **consistent pressure** across the thermal interface material (TIM), preventing hot spots and improving reliability under vibration. ### B. Fin Geometry (maxiFLOW™) The fins are designed with a tapered, flared structure. This is specifically engineered to: 1. **Maximize Surface Area:** More area for heat transfer to the air. 2. **Minimize Pressure Drop:** Allows air to flow through the sink more easily, which is crucial in densely packed electronic enclosures. ### C. Thermal Interface Material (TIM) The "C3" in the part number indicates the type of pre-applied thermal material. * It typically features a high-performance **T766 phase-change material** or high-conductivity grease. * This eliminates the need for manual application during assembly, reducing manufacturing errors. --- ## 4. Typical Applications This heat sink is typically found in the following electronic sectors: * **Telecommunications:** Optical modules and networking switches. * **Industrial:** Embedded controllers and power supplies. * **Computing:** Small Form Factor (SFF) PC cooling for voltage regulators or chipsets.