The **ATS-15B-178-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, specifically designed for cooling electronic components like CPUs, GPUs, FPGAs, and ASICs. Below is a detailed breakdown of its technical specifications and electronic application properties. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (LxWxH)** | 35.00mm x 35.00mm x 25.00mm | | **Thermal Resistance** | 3.96°C/W @ 200 LFM (Linear Feet per Minute) | | **Flow Direction** | Directional / Flared Fin | | **Compliance** | RoHS Compliant | --- ## 2. Key Design Features ### A. The maxiFLOW™ Fin Geometry The "178" in the part number refers to a specific fin profile. The fins are flared outwards, which increases the surface area for heat dissipation without significantly increasing the pressure drop. This design is highly effective in high-velocity airflow environments. ### B. pushPIN™ Attachment System The **-R0** suffix indicates the attachment style. This model uses a plastic push-pin and spring mechanism: * **Constant Pressure:** Ensures uniform contact between the heat sink and the electronic component (die/package). * **Secure Fit:** Prevents the heat sink from shifting during mechanical shock or vibration. ### C. Thermal Interface Material (TIM) The **-C2** designation typically signifies that the heat sink comes pre-applied with high-performance thermal grease or a phase-change material (PCM). This eliminates the air gap between the chip and the aluminum base, ensuring efficient heat transfer. --- ## 3. Electronic Application Use-Cases This component is typically used in the following electronic hardware: 1. **Network Switches/Routers:** Cooling high-speed packet processors. 2. **Embedded Computing:** Protecting ARM or x86 processors in industrial enclosures. 3. **Power Electronics:** Dissipating heat from MOSFET arrays or IGBT modules. 4. **Telecom Equipment:** Used on line cards where vertical space is limited to 25mm. ### Thermal Performance Table (Airflow vs. Resistance) | Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 4.90 | | 200 | 1.0 | 3.96 | | 300 | 1.5 | 3.40 | | 400 | 2.0 | 3.00 | --- ## 4. Assembly & Mounting To use this part on a Printed Circuit Board (PCB), the board must have **pre-drilled holes** corresponding to the 35mm footprint. The push-pins snap into these holes, providing a tool-less assembly that is ideal for mass production environments.