The **ATS-15B-192-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS). Below is a breakdown of its technical specifications and electronic application details. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Product Category** | Heat Sinks | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Thermal Resistance** | 2.35°C/W @ 100 LFM | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Components This part consists of three primary electronic/mechanical sub-components that work together to protect semiconductors: #### A. The Heat Sink Body The main body is made of **Aluminum 6063**, chosen for its excellent thermal conductivity. The **Blue Anodized** finish is not just for aesthetics; it increases the emissivity of the surface, allowing for better heat radiation and providing a layer of protection against electrical shorts and corrosion. #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the `-R0` series uses a mechanical push-pin system. * **Material:** Brass with a stainless steel spring. * **Purpose:** It ensures consistent pressure (compression) on the electronic component (CPU/GPU/FPGA), which minimizes the air gap and optimizes heat transfer. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. In electronics, the TIM is critical because it fills microscopic air gaps between the heat sink and the chip, significantly lowering the thermal resistance of the assembly. --- ### 3. Electronic Applications The ATS-15B-192-C2-R0 is designed for high-density electronic environments where airflow is directed. Common applications include: * **FPGA & ASICs:** Cooling high-speed logic gates in networking equipment. * **Processors:** Used on embedded CPUs in industrial computing. * **Power Supplies:** Cooling MOSFETs or IGPTs that generate significant heat during switching. ---