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  • ATS-15B-25-C2-R0

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    The **ATS-15B-25-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Component Specifications The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Base Dimensions** | 60mm x 60mm | | **Height** | 25mm | | **Thermal Resistance** | ~6.25 °C/W (Unducted Flow @ 200 LFM) | --- ### 2. Design and Construction The ATS-15B-25-C2-R0 features several engineering choices optimized for electronic thermal management: * **Heat Sink Profile (Fin Design):** It uses a **Straight Fin** design. This is ideal for systems with a defined airflow direction, as it allows air to pass through the channels with minimal pressure drop. * **pushPIN™ Attachment:** Instead of messy adhesives or thermal tape, this part uses a mechanical push-pin system. This ensures consistent pressure across the thermal interface material (TIM) for better heat transfer. * **Material:** Made from **Aluminum 6063**, which offers a great balance between thermal conductivity and weight. * **Surface Treatment:** The **Blue Anodized** finish is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, which slightly improves radiative cooling. --- ### 3. Thermal Performance Data Performance varies based on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 10.15 | | 200 (1.0 m/s) | 6.25 | | 400 (2.0 m/s) | 3.40 | | 600 (3.0 m/s) | 2.50 | --- ### 4. Part Number Breakdown Understanding the suffix codes helps in identifying the exact variant: * **ATS:** Advanced Thermal Solutions. * **15:** Internal series designation. * **B:** Push-pin material/type. * **25:** Height of the heat sink in millimeters. * **C2:** Thermal Interface Material (TIM) type (specifically **T766** pre-applied). * **R0:** Revision/Standard packaging code.
    ✨ Follow-up Questions
    • ⤷ What are the mounting hole dimensions required for this heat sink?
    • ⤷ Can this heat sink be used with a custom thermal paste instead of the pre-applied T766?
    • ⤷ How does the pressure of the push-pin system affect the thermal performance?