ATS-15B-25-C2-R0
AI

The **ATS-15B-25-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for cooling electronic components like CPUs, GPUs, or high-power transistors.
---
### 1. Component Specifications
The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics.
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Base Dimensions** | 60mm x 60mm |
| **Height** | 25mm |
| **Thermal Resistance** | ~6.25 °C/W (Unducted Flow @ 200 LFM) |
---
### 2. Design and Construction
The ATS-15B-25-C2-R0 features several engineering choices optimized for electronic thermal management:
* **Heat Sink Profile (Fin Design):** It uses a **Straight Fin** design. This is ideal for systems with a defined airflow direction, as it allows air to pass through the channels with minimal pressure drop.
* **pushPIN™ Attachment:** Instead of messy adhesives or thermal tape, this part uses a mechanical push-pin system. This ensures consistent pressure across the thermal interface material (TIM) for better heat transfer.
* **Material:** Made from **Aluminum 6063**, which offers a great balance between thermal conductivity and weight.
* **Surface Treatment:** The **Blue Anodized** finish is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, which slightly improves radiative cooling.
---
### 3. Thermal Performance Data
Performance varies based on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 10.15 |
| 200 (1.0 m/s) | 6.25 |
| 400 (2.0 m/s) | 3.40 |
| 600 (3.0 m/s) | 2.50 |
---
### 4. Part Number Breakdown
Understanding the suffix codes helps in identifying the exact variant:
* **ATS:** Advanced Thermal Solutions.
* **15:** Internal series designation.
* **B:** Push-pin material/type.
* **25:** Height of the heat sink in millimeters.
* **C2:** Thermal Interface Material (TIM) type (specifically **T766** pre-applied).
* **R0:** Revision/Standard packaging code.
- ⤷
What are the mounting hole dimensions required for this heat sink?
- ⤷ Can this heat sink be used with a custom thermal paste instead of the pre-applied T766?
- ⤷ How does the pressure of the push-pin system affect the thermal performance?