ATS-15B-29-C2-R0
AI

The **ATS-15B-29-C2-R0** is a specific electronic cooling component, categorized as a high-performance heat sink. It is manufactured by **Advanced Thermal Solutions (ATS)** and belongs to their **blueICE™** series.
Below is a detailed breakdown of its specifications and electronic application.
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## 1. Technical Specifications
This part is designed for thermal management in electronic systems where space is limited but heat dissipation requirements are high.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-15B-29-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W)** | 45.00 mm x 45.00 mm |
| **Height (Height Off Base)** | 20.00 mm |
| **Thermal Resistance** | 7.57 °C/W (at 100 LFM) |
| **Fin Pattern** | Square Cross-Cut (Grid) |
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## 2. Key Components & Design
The "Electronic Parts" of this assembly are divided into the structural cooling body and the mechanical mounting hardware:
### A. The Heat Sink Body
* **Material:** Extruded 6063 aluminum, chosen for its high thermal conductivity and lightweight properties.
* **Fin Style:** The **Cross-Cut** design allows for multi-directional airflow. This is critical in modern electronic enclosures where the direction of the cooling fan's exhaust might not be perfectly aligned with the sink.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is the "part" that sits between the CPU/GPU and the metal, filling microscopic air gaps to ensure efficient heat transfer.
### B. The pushPIN™ Mounting System
Rather than using messy adhesives or simple clips, the ATS-15B-29-C2-R0 uses a precise mechanical assembly:
* **Brass Components:** The pins are often nickel-plated brass for durability.
* **Stainless Steel Springs:** Provide consistent downward pressure (force) to ensure the heat sink remains in contact with the electronic chip during vibrations or thermal expansion.
* **Plastic/POM Fasteners:** The "R0" designation refers to the specific hardware kit used to lock the sink into the PCB holes.
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## 3. Electronic Application
This part is typically used to cool the following types of electronic components:
1. **CPUs / Microprocessors:** Small form factor computing.
2. **FPGAs (Field Programmable Gate Arrays):** Which generate significant heat in high-speed data processing.
3. **ASICs:** Application-specific integrated circuits used in networking and telecommunications.
4. **LED Power Drivers:** High-output lighting controllers.
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- ⤷
What is the significance of the 'C2' designation in the ATS part numbering system?
- ⤷ How does the pushPIN™ system compare to adhesive thermal tapes for PCB safety?
- ⤷ What is the recommended airflow (LFM) for optimal performance of this specific heat sink?