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  • ATS-15B-29-C2-R0

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    The **ATS-15B-29-C2-R0** is a specific electronic cooling component, categorized as a high-performance heat sink. It is manufactured by **Advanced Thermal Solutions (ATS)** and belongs to their **blueICE™** series. Below is a detailed breakdown of its specifications and electronic application. --- ## 1. Technical Specifications This part is designed for thermal management in electronic systems where space is limited but heat dissipation requirements are high. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-15B-29-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height (Height Off Base)** | 20.00 mm | | **Thermal Resistance** | 7.57 °C/W (at 100 LFM) | | **Fin Pattern** | Square Cross-Cut (Grid) | --- ## 2. Key Components & Design The "Electronic Parts" of this assembly are divided into the structural cooling body and the mechanical mounting hardware: ### A. The Heat Sink Body * **Material:** Extruded 6063 aluminum, chosen for its high thermal conductivity and lightweight properties. * **Fin Style:** The **Cross-Cut** design allows for multi-directional airflow. This is critical in modern electronic enclosures where the direction of the cooling fan's exhaust might not be perfectly aligned with the sink. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is the "part" that sits between the CPU/GPU and the metal, filling microscopic air gaps to ensure efficient heat transfer. ### B. The pushPIN™ Mounting System Rather than using messy adhesives or simple clips, the ATS-15B-29-C2-R0 uses a precise mechanical assembly: * **Brass Components:** The pins are often nickel-plated brass for durability. * **Stainless Steel Springs:** Provide consistent downward pressure (force) to ensure the heat sink remains in contact with the electronic chip during vibrations or thermal expansion. * **Plastic/POM Fasteners:** The "R0" designation refers to the specific hardware kit used to lock the sink into the PCB holes. --- ## 3. Electronic Application This part is typically used to cool the following types of electronic components: 1. **CPUs / Microprocessors:** Small form factor computing. 2. **FPGAs (Field Programmable Gate Arrays):** Which generate significant heat in high-speed data processing. 3. **ASICs:** Application-specific integrated circuits used in networking and telecommunications. 4. **LED Power Drivers:** High-output lighting controllers. ---
    ✨ Follow-up Questions
    • ⤷ What is the significance of the 'C2' designation in the ATS part numbering system?
    • ⤷ How does the pushPIN™ system compare to adhesive thermal tapes for PCB safety?
    • ⤷ What is the recommended airflow (LFM) for optimal performance of this specific heat sink?