The **ATS-15B-33-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum (Body), Blue Anodized (Finish) | | **Thermal Resistance** | 17.42°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 15.00mm | | **Fin Style** | Straight (Fine Pitch) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features and Components #### A. pushPIN™ Attachment System The "R0" suffix indicates the use of the **pushPIN™** system. This consists of: * **Compression Springs:** Provide precise pressure to ensure maximum thermal contact between the heat sink and the chip. * **Brass/Plastic Pins:** Secure the assembly to pre-drilled holes in the PCB. #### B. maxiFLOW™ Design This series features a spread-fin geometry. Unlike traditional square-fin heat sinks, the maxiFLOW™ profile reduces pressure drop and increases the surface area exposed to airflow, making it highly efficient for forced-convection environments. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a high-performance thermal grease that fills microscopic air gaps between the component and the heat sink base, significantly reducing thermal resistance at the contact point. --- ### 3. Electronic Application This part is typically used in the following scenarios: * **Telecommunications:** Cooling line cards or high-speed routers. * **Industrial PC:** Cooling processors in compact enclosures. * **Power Supplies:** Dissipating heat from MOSFETs or IGBTs. --- ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **15B** | Series/Physical Profile | | **33** | Specific Dimension Configuration | | **C2** | Thermal Performance Level / Material Grade | | **R0** | Revision / Packaging / Attachment Kit |