## Analysis of Electronic Part: ATS-15B-34-C2-R0 The **ATS-15B-34-C2-R0** is a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for thermal management of surface-mount components like CPUs, GPUs, or power modules. --- ### 1. Component Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Type** | Fin-Type Heat Sink | | **Material** | Aluminum (Blue Anodized Finish) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Base Dimensions** | 54.00 mm x 54.00 mm | | **Height** | 20.00 mm | | **Mounting Hole Pattern** | 47.00 mm x 47.00 mm | | **Thermal Resistance** | 14.33 °C/W (Unducted Flow @ 100 LFM) | --- ### 2. Thermal Performance Data Thermal resistance indicates how effectively the heat sink transfers heat away from the component into the surrounding air. Lower values are better. | Air Velocity (LFM) | 100 (0.5 m/s) | 200 (1.0 m/s) | 300 (1.5 m/s) | 400 (2.0 m/s) | | :--- | :--- | :--- | :--- | :--- | | **Unducted Flow (°C/W)** | 14.33 | 5.19 | 2.73 | 1.80 | | **Ducted Flow (°C/W)** | 2.06 | 1.35 | 1.13 | 1.01 | --- ### 3. Key Electronic/Mechanical Features * **Fin Geometry:** It features a **Fine Pitch** design, which increases the surface area for cooling, making it ideal for high-airflow environments. * **Push-Pin Attachment:** The `-R0` suffix indicates a specific kit that includes a pre-assembled push-pin and spring mechanism. This ensures: * Consistent pressure across the thermal interface material (TIM). * Secure mounting without the need for specialized tools. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal grease. * **Material:** The aluminum body provides a balance between weight and thermal conductivity, while the blue anodized coating prevents oxidation and improves emissivity. --- ### 4. Typical Applications This component is commonly used in industrial and consumer electronics where heat dissipation is critical: 1. **Network Switches/Routers:** Cooling ASICs and processors. 2. **Power Supplies:** Managing heat from MOSFETs or IGBTs. 3. **Embedded Systems:** Industrial PCs where space is limited but cooling demands are high. ---