The **ATS-15B-35-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Blue Ice" series of high-performance heat sinks designed for electronic cooling applications. --- ## 1. Component Overview This part is a **passive cooling device** primarily used to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, FPGAs, or power transistors. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-15B-35-C2-R0 | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | Approx. 12.00°C/W (Unducted Flow) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Footprint Size** | 35mm x 35mm | | **Height** | 10.00mm | --- ## 2. Part Number Breakdown (Nomenclature) The part number follows a specific logic used by ATS to identify the dimensions and mounting style: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **15B**: Refers to the specific fin design or series. * **35**: Indicates the dimensions of the base (35mm x 35mm). * **C2**: Refers to the thermal interface material (TIM) or specific coating/performance tier. * **R0**: Version or revision code. --- ## 3. Key Electronic Functions ### Heat Dissipation The main electronic function is to increase the surface area of a heat-generating component. This facilitates **convective heat transfer** to the surrounding air, preventing the semiconductor junction from reaching critical temperatures that lead to thermal throttling or hardware failure. ### The pushPIN™ Attachment System This specific model uses a spring-loaded pin system. The benefits include: * **Constant Pressure:** Ensures the thermal interface material (TIM) is evenly spread for maximum conductivity. * **Mechanical Stability:** Protects the electronic component from shifting during vibration or transport. * **Ease of Assembly:** Features pre-drilled holes for rapid installation on a PCB. --- ## 4. Usage Considerations When integrating this part into a circuit design, engineers must consider: 1. **Airflow Direction:** The fin alignment (cross-cut) allows for airflow from multiple directions. 2. **Clearance:** Ensure the 10mm height does not interfere with neighboring components or the device chassis. 3. **Thermal Interface:** This part usually comes with a pre-applied thermal pad or requires high-quality thermal grease to bridge the microscopic gaps between the IC and the aluminum base.