The **ATS-15B-50-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to maximize heat dissipation in environments with restricted airflow. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Flowing)** | 1.88°C/W @ 200 LFM | | **Thermal Resistance (Static)** | 8.99°C/W (Unducted) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Compliance** | RoHS Compliant | --- ### 2. Key Electronic & Mechanical Features #### A. The maxiFLOW™ Design The "B" in the part number refers to the **maxiFLOW™** geometry. This design features a spread fin structure that increases surface area and creates turbulence in the airflow, which significantly enhances the cooling capacity compared to standard straight-fin heat sinks. #### B. pushPIN™ Attachment System The **-R0** suffix indicates the inclusion of the pushPIN™ mounting system. This system includes: * **Flexible Springs:** Ensure precise pressure (Normal Force) on the electronic component (CPU, GPU, or FPGA) to optimize thermal interface material (TIM) performance. * **Pre-drilled Holes:** Designed for easy installation onto PCBs without needing specialized tools. #### C. Thermal Interface Material (TIM) The **C2** designation typically signifies that the heat sink comes pre-assembled with **T766** phase-change thermal material or a high-performance thermal pad. This ensures low thermal impedance between the component die and the aluminum base. --- ### 3. Application Use-Cases This heat sink is commonly used in high-density electronic assemblies where space is limited but heat output is high: * **Networking Gear:** Switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or power ICs. * **Telecommunications:** Base station hardware. --- ### 4. Part Number Breakdown `ATS - 15 B - 50 - C2 - R0` * **ATS:** Manufacturer (Advanced Thermal Solutions). * **15:** Height (15mm). * **B:** maxiFLOW™ Fin pattern. * **50:** Product specific series/width code. * **C2:** Thermal Interface Material / Performance grade. * **R0:** Packaging and Mounting (pushPIN™).