The **ATS-15B-64-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink** from the *pushPIN™* series manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its electronic and mechanical specifications. --- ### 1. General Specifications | Feature | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Product Category** | Board Level Heat Sinks | | **Mounting Type** | pushPIN™ (Spring-loaded) | | **Attachment Method** | Push-Pin | --- ### 2. Physical Dimensions This heat sink is designed for compact cooling requirements on PCBs (Printed Circuit Boards). | Dimension | Measurement (mm) | | :--- | :--- | | **Width / Length** | 45.00 mm x 45.00 mm | | **Height (from base)** | 25.00 mm | | **Pin Pitch (Hole Spacing)** | 38.00 mm | --- ### 3. Thermal Performance The efficiency of this part is measured by its **Thermal Resistance**, which determines how effectively it moves heat away from the electronic component (CPU, FPGA, MOSFET). | Airflow Condition | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted Flow (@1.0 m/s)** | 9.39 °C/W | | **Ducted Flow (@1.0 m/s)** | 1.64 °C/W | --- ### 4. Technical Characteristics & Material * **Material:** High-grade Aluminum. * **Finish:** Blue Anodized (provides corrosion resistance and improved emissivity). * **Fin Type:** **XCUT** (Cross-cut design). This allows for multi-directional airflow, making it ideal for systems where air may flow from various angles rather than a straight line. * **Interface Material:** **T766** Thermal Interface Material (TIM). This is a pre-applied phase-change material or grease that ensures maximum heat transfer between the component and the heat sink. --- ### 5. Part Number Nomenclature Understanding the suffix codes: * **ATS-15B:** Series identification. * **64:** Specific fin pattern/geometry. * **C2:** Material/Color code (Aluminum, Blue Anodized). * **R0:** Revision code or packaging standard. --- ### Summary Table: Application Use-Case | Component Type | Suitability | | :--- | :--- | | **FPGAs / ASICs** | Excellent for mid-range power densities. | | **Power Supplies** | Good for cooling high-power transistors. | | **Communication Gear** | Ideal for 1U or 2U rack-mount height constraints. |