## Overview of ATS-15B-68-C2-R0 The **ATS-15B-68-C2-R0** is a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **blueICE™** series and is specifically designed for component cooling in electronic assemblies where space is limited but high thermal conductivity is required. --- ### Technical Specifications The following table outlines the mechanical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | blueICE™ / pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 15.31°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Pitch** | Fine Pitch (High fin density) | --- ### Key Electronic & Mechanical Components 1. **Heat Sink Body:** * Made from **Aluminum 6063**, which offers an excellent balance between thermal conductivity and structural integrity. * The **Blue Anodized finish** is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, slightly improving radiant heat transfer. 2. **Fin Design:** * This model utilizes a **Straight Fin** pattern. * The "Fine Pitch" design maximizes the surface area available for air-to-metal contact, making it ideal for high-velocity airflow environments (forced convection). 3. **The pushPIN™ Mounting System:** * Unlike adhesive tapes, this part uses a mechanical spring-loaded pin system. * **Advantages:** It ensures consistent pressure (Interface Pressure) between the heat sink and the electronic component (CPU/GPU/FPGA), which optimizes the Thermal Interface Material (TIM) performance. 4. **Compatibility:** * Designed to fit industry-standard PCB hole patterns. * The "C2" in the part number typically refers to the specific Thermal Interface Material (TIM) pre-applied to the base (often a high-performance phase-change material or thermal pad). --- ### Application Scenarios | Application | Benefit | | :--- | :--- | | **Telecommunications** | Cooling line cards and high-speed networking chips. | | **Embedded Systems** | Managing heat in compact industrial PC enclosures. | | **Power Supplies** | Dissipating heat from MOSFETs or voltage regulators. |