## Technical Overview: ATS-15B-69-C2-R0 The **ATS-15B-69-C2-R0** is a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **blueICE™** series, specifically designed for cooling electronic components such as CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Key Technical Specifications | Parameter | Specification | Details | | :--- | :--- | :--- | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Enhances emissivity and prevents corrosion | | **Attachment Method** | pushPIN™ | Uses a spring-loaded pin mechanism for secure mounting | | **Dimensions** | 45mm x 45mm | Standard square footprint | | **Height (Fin)** | 20.00 mm | Low-to-mid profile for airflow efficiency | | **Thermal Resistance** | 11.31°C/W (Unducted) | Performance at 100 LFM (Linear Feet per Minute) | | **Weight** | ~40 grams | Reduced strain on the PCB | --- ### 2. Component Features & Benefits * **pushPIN™ Design:** This component utilizes a specialized attachment system. The push-pin has a built-in spring that provides a precise, consistent pressure (preload) against the heat source, ensuring optimal thermal interface material (TIM) performance. * **Straight Fin Pattern:** The fins are arranged in a straight-line configuration, which is ideal for systems with a defined directional airflow. * **C2 Material Grade:** The "C2" suffix typically refers to the specific thermal interface material (pre-applied phase-change material or foil) or the specific aluminum alloy grade used in the base. * **RoHS Compliant:** The "R0" indicates that the part is lead-free and meets international environmental safety standards. --- ### 3. Thermal Performance Comparison Performance varies based on the airflow (LFM) provided by system fans: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.31 | | 300 (1.5 m/s) | 4.42 | | 500 (2.5 m/s) | 3.16 | | 700 (3.5 m/s) | 2.58 | --- ### 4. Application Areas * **Telecommunications:** Cooling of networking switches and routers. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Heat dissipation for MOSFETs and voltage regulators. ---