The **ATS-15B-71-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc.** It is part of the "pushPIN™" thermal management series designed for cooling electronic components, specifically integrated circuits (ICs) and CPUs. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Type** | Push Pin (with Spring) | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height** | 30.00 mm | | **Pitch** | Fine-Pitch | | **Thermal Resistance (Unducted)** | 6.73 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.15 °C/W @ 100 LFM | | **RoHS Status** | Compliant | --- ### 2. Key Design Elements #### A. Fin Geometry This model uses a **Straight Fin** design with a **Fine-Pitch** pattern. - **Efficiency:** The dense fin arrangement maximizes surface area, allowing for superior heat dissipation in environments with high airflow. - **Orientation:** It is optimized for systems where air flows in a specific direction across the heat sink. #### B. Mounting Mechanism (pushPIN™) The "pushPIN™" system is designed to provide a secure, standardized attachment: * **Ease of Install:** Uses a flexible attachment tool that snaps into pre-drilled holes on the PCB. * **Pre-assembled Springs:** The springs provide consistent pressure (loading) across the component to ensure maximum thermal contact with the TIM (Thermal Interface Material). #### C. Thermal Interface Material (TIM) The "R0" suffix indicates that the heat sink typically comes with **T766** thermal material pre-applied. This ensures low thermal resistance between the heat-generating component and the aluminum base. --- ### 3. Application Use Cases This specific heat sink is commonly found in: 1. **Networking Hardware:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Supplies:** Cooling voltage regulators and power MOSFETs. 4. **Processors:** Cooling mid-range CPUs or GPUs on custom PCBs. ---