The **ATS-15B-76-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" attachment series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Push-Pin (Passive/Active compatible) | | **Material** | Aluminum | | **Fin Type** | Straight Fin | | **Finish** | Blue Anodized | | **Thermal Resistance** | 11.50°C/W (Unducted @ 200 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Component Features ### A. Fin Geometry The "Straight Fin" design is optimized for environments with consistent airflow (forced convection). This allows air to flow through the channels efficiently, carrying heat away from the base. ### B. Attachment Mechanism (Push-Pin) This part uses a **Push-Pin and Spring** assembly. * **Ease of Install:** Allows for quick mounting onto a Printed Circuit Board (PCB). * **Compression:** The spring provides consistent pressure across the thermal interface, ensuring maximum heat transfer from the chip to the aluminum. * **Compatibility:** Pre-drilled holes in the PCB are required for these pins. ### C. Thermal Interface Material (TIM) The **C2** in the part number indicates a specific thermal pad or grease pre-applied to the base (T766). This fills microscopic air gaps between the component and the heat sink to improve thermal conductivity. ### D. Material and Finish * **Aluminum:** Lightweight and provides excellent thermal conductivity. * **Blue Anodized:** Not just for aesthetics; the anodized layer provides increased surface area at a microscopic level and protects the aluminum from corrosion. --- ## 3. Application Use Cases This specific size (25mm x 25mm) is commonly used for: 1. **Network Switches:** Cooling ASICs and controllers. 2. **Embedded Systems:** Cooling small-form-factor processors. 3. **Power Supplies:** Managing heat for voltage regulators and MOSFETs. ---