ATS-15B-80-C2-R0
AI

The **ATS-15B-80-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW" series, designed primarily for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs.
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### 1. Technical Specifications
The model number encodes several key physical and performance characteristics:
| Property | Specification | Details |
| :--- | :--- | :--- |
| **Dimensions** | 30mm x 30mm | Base dimensions (LxW) |
| **Height** | 15mm | Total height including fins |
| **Material** | Aluminum | High thermal conductivity |
| **Finish** | Blue Anodized | Enhances corrosion resistance and thermal radiation |
| **Attachment** | pushPIN™ | Spring-loaded mounting for secure thermal contact |
| **Thermal Resistance** | ~7.03°C/W (Unducted) | Varies based on airflow (LFM) |
| **Thermal Interface** | T766 | Pre-applied high-performance Phase Change Material (PCM) |
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### 2. Design Features
The "C2" and "R0" designations refer to specific material and environmental compliance standards:
* **maxiFLOW™ Technology:** Features a flared fin structure that increases the surface area for maximum heat dissipation while maintaining a low pressure drop.
* **pushPIN™ Mounting:** This mechanism uses a brass pin and a stainless steel spring. It ensures even pressure across the component surface, which optimizes the performance of the Thermal Interface Material (TIM).
* **RoHS Compliant:** The "R0" indicates that the part meets the Restriction of Hazardous Substances directive, making it safe for global industrial use.
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### 3. Thermal Performance Comparison
Performance depends heavily on the airflow (measured in Linear Feet per Minute - LFM).
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **200 (1.0 m/s)** | 7.03 |
| **400 (2.0 m/s)** | 4.62 |
| **600 (3.0 m/s)** | 3.67 |
| **800 (4.0 m/s)** | 3.17 |
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### 4. Typical Applications
* **Networking Hardware:** High-speed routers and switches.
* **Industrial PCs:** Compact embedded systems where space is limited.
* **Power Supplies:** Cooling MOSFETs or voltage regulators.
* **Consumer Electronics:** High-end audio or imaging processors.
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How does the pushPIN mounting system compare to standard adhesive backing?
- ⤷ What are the advantages of the flared fin design in the maxiFLOW series?
- ⤷ Can the T766 thermal interface material be reused if the heat sink is removed?