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  • ATS-15B-80-C2-R0

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    The **ATS-15B-80-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW" series, designed primarily for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Technical Specifications The model number encodes several key physical and performance characteristics: | Property | Specification | Details | | :--- | :--- | :--- | | **Dimensions** | 30mm x 30mm | Base dimensions (LxW) | | **Height** | 15mm | Total height including fins | | **Material** | Aluminum | High thermal conductivity | | **Finish** | Blue Anodized | Enhances corrosion resistance and thermal radiation | | **Attachment** | pushPIN™ | Spring-loaded mounting for secure thermal contact | | **Thermal Resistance** | ~7.03°C/W (Unducted) | Varies based on airflow (LFM) | | **Thermal Interface** | T766 | Pre-applied high-performance Phase Change Material (PCM) | --- ### 2. Design Features The "C2" and "R0" designations refer to specific material and environmental compliance standards: * **maxiFLOW™ Technology:** Features a flared fin structure that increases the surface area for maximum heat dissipation while maintaining a low pressure drop. * **pushPIN™ Mounting:** This mechanism uses a brass pin and a stainless steel spring. It ensures even pressure across the component surface, which optimizes the performance of the Thermal Interface Material (TIM). * **RoHS Compliant:** The "R0" indicates that the part meets the Restriction of Hazardous Substances directive, making it safe for global industrial use. --- ### 3. Thermal Performance Comparison Performance depends heavily on the airflow (measured in Linear Feet per Minute - LFM). | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 7.03 | | **400 (2.0 m/s)** | 4.62 | | **600 (3.0 m/s)** | 3.67 | | **800 (4.0 m/s)** | 3.17 | --- ### 4. Typical Applications * **Networking Hardware:** High-speed routers and switches. * **Industrial PCs:** Compact embedded systems where space is limited. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Consumer Electronics:** High-end audio or imaging processors.
    ✨ Follow-up Questions
    • ⤷ How does the pushPIN mounting system compare to standard adhesive backing?
    • ⤷ What are the advantages of the flared fin design in the maxiFLOW series?
    • ⤷ Can the T766 thermal interface material be reused if the heat sink is removed?