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  • ATS-15B-83-C2-R0

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    The **ATS-15B-83-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** product line, designed for cooling high-power semiconductors. --- ## 1. Technical Specifications The part number encodes specific physical and thermal properties. Below are the core specifications: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.60° C/W (at 200 LFM) | | **Flow Direction** | Cross-Cut (Omni-directional) | | **Length x Width** | 30.00 mm x 30.00 mm | | **Height** | 25.00 mm | --- ## 2. Key Component Features ### A. maxiFLOW™ Design The heat sink uses a tapered fin structure. This design increases the surface area for heat dissipation while maintaining a low pressure drop. This is critical for systems with constrained airflow. ### B. pushPIN™ Attachment Unlike adhesive-based heat sinks, the `-R0` suffix indicates a **pushPIN™** assembly. * **Hardware:** It includes pre-assembled springs and plastic/brass pins. * **Reliability:** Provides consistent pressure (TIM compression) and is more resistant to shock and vibration compared to thermal tape. ### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766** phase-change material or high-performance grease. This ensures a minimal thermal gap between the heat source (CPU/GPU/FPGA) and the aluminum base. --- ## 3. Typical Applications This specific sizing (30mm x 30mm) is commonly used for: 1. **Network Switches & Routers:** Cooling ASICs and processors. 2. **Power Supplies:** Heat dissipation for MOSFETs and IGBTs. 3. **Industrial PCs:** Cooling embedded chips in high-temperature environments. --- ## 4. Part Number Breakdown The nomenclature follows the ATS standard convention: | Code | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **15B** | Series / Product Family | | **83** | Specific Fin Geometry and Dimensions | | **C2** | Thermal Performance Grade / Material Coating | | **R0** | RoHS Compliant / Revision Status |
    ✨ Follow-up Questions
    • ⤷ What are the alternative attachment methods if my PCB doesn't have holes for pushPINs?
    • ⤷ How does the blue anodized finish impact the thermal emissivity of the part?
    • ⤷ What is the recommended hole size for the pushPIN installation on a PCB?