ATS-15B-83-C2-R0
AI

The **ATS-15B-83-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** product line, designed for cooling high-power semiconductors.
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## 1. Technical Specifications
The part number encodes specific physical and thermal properties. Below are the core specifications:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 1.60° C/W (at 200 LFM) |
| **Flow Direction** | Cross-Cut (Omni-directional) |
| **Length x Width** | 30.00 mm x 30.00 mm |
| **Height** | 25.00 mm |
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## 2. Key Component Features
### A. maxiFLOW™ Design
The heat sink uses a tapered fin structure. This design increases the surface area for heat dissipation while maintaining a low pressure drop. This is critical for systems with constrained airflow.
### B. pushPIN™ Attachment
Unlike adhesive-based heat sinks, the `-R0` suffix indicates a **pushPIN™** assembly.
* **Hardware:** It includes pre-assembled springs and plastic/brass pins.
* **Reliability:** Provides consistent pressure (TIM compression) and is more resistant to shock and vibration compared to thermal tape.
### C. Thermal Interface Material (TIM)
The part comes pre-applied with **T766** phase-change material or high-performance grease. This ensures a minimal thermal gap between the heat source (CPU/GPU/FPGA) and the aluminum base.
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## 3. Typical Applications
This specific sizing (30mm x 30mm) is commonly used for:
1. **Network Switches & Routers:** Cooling ASICs and processors.
2. **Power Supplies:** Heat dissipation for MOSFETs and IGBTs.
3. **Industrial PCs:** Cooling embedded chips in high-temperature environments.
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## 4. Part Number Breakdown
The nomenclature follows the ATS standard convention:
| Code | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Manufacturer) |
| **15B** | Series / Product Family |
| **83** | Specific Fin Geometry and Dimensions |
| **C2** | Thermal Performance Grade / Material Coating |
| **R0** | RoHS Compliant / Revision Status |
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What are the alternative attachment methods if my PCB doesn't have holes for pushPINs?
- ⤷ How does the blue anodized finish impact the thermal emissivity of the part?
- ⤷ What is the recommended hole size for the pushPIN installation on a PCB?