The **ATS-15B-85-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" attachment series designed for cooling processors and high-heat surface-mount components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Type** | Push-Pin (Plastic) | | **Dimension (L x W)** | 35mm x 35mm | | **Height** | 10.00mm | | **Fin Style** | Square Pin (Fine Pitch) | | **Thermal Resistance** | 23.98°C/W (at natural convection) | | **Spring Type** | Brass Spring | --- ### 2. Design and Component Breakdown #### A. Fin Geometry The "85" in the part number signifies the specific fin configuration. This model uses a **Square Pin Fin** design. * **Omnidirectional Airflow:** Unlike straight-fin heat sinks, pin fins allow air to flow through the heat sink from any direction, making it ideal for systems where the airflow direction is unpredictable or turbulent. * **Increased Surface Area:** The pin structure maximizes the ratio of surface area to volume, improving heat dissipation in compact spaces. #### B. Attachment Mechanism (Push-Pin) Instead of adhesive tapes, this model uses a mechanical **Push-Pin** system: * **Reliability:** Provides consistent pressure on the component (e.g., a BGA chip), ensuring a better interface between the chip and the heat sink. * **Serviceability:** Allows for easy removal and re-application of thermal paste if needed. #### C. Thermal Interface Material (TIM) The "C2" suffix indicates the type of pre-applied thermal material: * **T766 Phase Change Material:** This is usually pre-applied to the base. It remains solid at room temperature but melts and fills microscopic gaps when the electronic component heats up, significantly reducing thermal resistance. --- ### 3. Application Use Cases This specific heat sink is typically found in: * **Telecommunications:** High-speed routers and switches. * **Industrial PCs:** Compact motherboards where vertical space is limited (10mm height). * **Embedded Systems:** Cooling FPGAs, ASICs, or Video Processors. --- ### 4. Part Number Decoder Understanding the "ATS-15B-85-C2-R0" nomenclature: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **15B:** Series/Family (Push-pin attachment). * **85:** Specific fin density/pattern design. * **C2:** Thermal Interface Material (T766) and Blue Anodized finish. * **R0:** RoHS Compliance (Revision/standard).