ATS-15B-93-C2-R0
AI

The **ATS-15B-93-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "maxiFLOW™" series, designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs.
### 1. Technical Specifications
Below are the key electronic and physical specifications for this part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-15B-93-C2-R0 |
| **Thermal Resistance** | 7.37°C/W (at 100 LFM) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W x H)** | 40mm x 40mm x 20mm |
| **Fin Type** | Straight Fin |
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### 2. Key Components & Features
#### A. Thermal Performance
This part is designed to optimize airflow. The thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases:
* **7.37°C/W** at 100 LFM
* **2.32°C/W** at 400 LFM
* **1.50°C/W** at 800 LFM
#### B. pushPIN™ Attachment
Unlike adhesive tapes that can fail under high heat, this part uses the **pushPIN™ system**. This involves:
* **Spring-loaded pins:** These provide a precise, consistent pressure (preload) on the electronic chip.
* **Plastic/Brass Pins:** Designed to snap into pre-drilled holes on the Printed Circuit Board (PCB).
#### C. Material and Interface
* **Aluminum Construction:** Offers a balance between lightweight design and high thermal conductivity.
* **Thermal Interface Material (TIM):** The part typically comes with a pre-applied high-performance thermal phase-change material (T766) to ensure there is no air gap between the chip and the heat sink.
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### 3. Electronic Application
This part is typically found in the following electronic environments:
1. **Telecommunications:** Cooling line cards and routers.
2. **Embedded Systems:** Industrial PCs where fan noise must be minimized but heat dissipation is critical.
3. **Power Electronics:** Managing heat for voltage regulators or high-speed processors.
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- ⤷
What is the difference between pushPIN™ and adhesive heat sink attachments?
- ⤷ How do I calculate if 7.37°C/W is sufficient for my specific processor?
- ⤷ Can this heat sink be used with a custom cooling fan?