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  • ATS-15B-93-C2-R0

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    The **ATS-15B-93-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "maxiFLOW™" series, designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications Below are the key electronic and physical specifications for this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-15B-93-C2-R0 | | **Thermal Resistance** | 7.37°C/W (at 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Fin Type** | Straight Fin | --- ### 2. Key Components & Features #### A. Thermal Performance This part is designed to optimize airflow. The thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases: * **7.37°C/W** at 100 LFM * **2.32°C/W** at 400 LFM * **1.50°C/W** at 800 LFM #### B. pushPIN™ Attachment Unlike adhesive tapes that can fail under high heat, this part uses the **pushPIN™ system**. This involves: * **Spring-loaded pins:** These provide a precise, consistent pressure (preload) on the electronic chip. * **Plastic/Brass Pins:** Designed to snap into pre-drilled holes on the Printed Circuit Board (PCB). #### C. Material and Interface * **Aluminum Construction:** Offers a balance between lightweight design and high thermal conductivity. * **Thermal Interface Material (TIM):** The part typically comes with a pre-applied high-performance thermal phase-change material (T766) to ensure there is no air gap between the chip and the heat sink. --- ### 3. Electronic Application This part is typically found in the following electronic environments: 1. **Telecommunications:** Cooling line cards and routers. 2. **Embedded Systems:** Industrial PCs where fan noise must be minimized but heat dissipation is critical. 3. **Power Electronics:** Managing heat for voltage regulators or high-speed processors. ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between pushPIN™ and adhesive heat sink attachments?
    • ⤷ How do I calculate if 7.37°C/W is sufficient for my specific processor?
    • ⤷ Can this heat sink be used with a custom cooling fan?