The **ATS-15B-95-C2-R0** is a specific electronic component primarily classified as a **High-Performance Heat Sink**. It is part of the "pushPIN™" thermal management line manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its specifications and electronic/mechanical properties. --- ### 1. General Specifications This part is designed to dissipate heat from electronic components like CPUs, GPUs, FPGAs, or power transistors to prevent thermal throttling or failure. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | pushPIN™ | | **Part Number** | ATS-15B-95-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 7.29 °C/W (at 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | --- ### 2. Physical Dimensions Precision in dimensions is critical for ensuring the heat sink fits within the allocated PCB real estate. * **Width/Length:** 40.00 mm x 40.00 mm * **Height:** 25.00 mm (Distance from the chip surface to the top of the fins) * **Pitch (Fin Spacing):** Fine Pitch design to maximize surface area. * **Hole Pattern:** 45.00 mm x 45.00 mm (Required distance between mounting holes on the PCB). --- ### 3. Thermal Performance Metrics Thermal resistance indicates how efficiently the part moves heat away from the semiconductor junction. The performance improves as airflow (measured in Linear Feet per Minute - LFM) increases. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 7.29 | | 200 (1.0 m/s) | 2.48 | | 300 (1.5 m/s) | 1.47 | | 500 (2.5 m/s) | 1.01 | --- ### 4. Technical Features * **pushPIN™ Attachment:** The "15B" designation refers to the specific attachment style. It uses a flexible, spring-loaded pin mechanism that provides high pressure and ensures a secure fit, even under vibration. * **Thermal Interface Material (TIM):** This specific model ("C2") typically comes with a pre-applied high-performance thermal grease to bridge the microscopic air gaps between the component and the heat sink. * **Aluminum Construction:** Offers a balance between weight (lightweight) and thermal conductivity. * **Blue Anodized Coating:** Provides corrosion resistance and slightly improves radiative cooling. --- ### 5. Application Context The ATS-15B-95-C2-R0 is commonly used in: * **Telecommunications:** Networking switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs and voltage regulators.