The **ATS-15B-97-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **push-pin style heat sink** designed for cooling integrated circuits (ICs), such as CPUs, GPUs, or FPGAs. Below is a detailed breakdown of its specifications and features. --- ### 1. Technical Specifications This part belongs to the **maxiFLOW™** series by Advanced Thermal Solutions (ATS). | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-15B-97-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 2.03° C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Components & Construction #### A. Heat Sink Geometry (maxiFLOW™) The "97" series utilizes a tapered fin design. This geometry is engineered to maximize surface area while minimizing pressure drop. The spread-fin pattern is ideal for high-velocity airflow environments. #### B. Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, this model uses **Brass Push-Pins**. * **Benefits:** Provides consistent pressure to the processor for optimal thermal transfer. * **Reliability:** Mechanical attachment is more secure than thermal tape in high-vibration or high-heat environments. * **Springs:** Usually paired with a stainless steel spring to ensure the correct downward force. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766**. This is a high-performance phase-change material or grease that fills microscopic air gaps between the heat sink and the electronic component to lower thermal resistance. #### D. Material Coating The **Blue Anodized** finish is not just aesthetic; it provides: * Increased corrosion resistance. * Improved surface emissivity, which slightly aids in radiant heat transfer. * Electrical insulation of the aluminum surface. --- ### 3. Performance Data Thermal performance varies based on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 2.03 | | 400 (2.0 m/s) | 1.15 | | 600 (3.0 m/s) | 0.82 | --- ### 4. Applications * **Telecommunications:** Cooling of networking switches and routers. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Heat dissipation for high-power transistors.