The **ATS-15B-98-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Type** | Top Mount Heat Sink | | **Material** | Aluminum (Blue Anodized Finish) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 20mm | | **Fin Style** | Cross-Cut (Square pins/fins) | | **Thermal Resistance** | 15.31°C/W (Unducted Flow @ 100 LFM) | --- ### Key Components & Features #### 1. PushPIN™ Attachment Unlike adhesive tapes or simple clips, the "15B" series uses a **pushPIN™** system. This consists of: * **Plastic or Brass Pins:** Inserted through pre-drilled holes in the PCB. * **Compression Springs:** Provide consistent pressure (force) to ensure the heat sink remains in tight contact with the component. #### 2. Cross-Cut Fin Design The "98" in the part number refers to the specific fin pattern. This heat sink uses a **cross-cut** or "pin fin" geometry. * **Benefit:** This design allows for multidirectional airflow. Unlike straight fins, which require air to move in one specific direction, cross-cut fins work efficiently regardless of where the fan is placed in the chassis. #### 3. Thermal Interface Material (TIM) The **C2** designation indicates that the heat sink comes pre-applied with **T766 Phase Change Material**. * This acts as the bridge between the electronic chip and the aluminum body, filling microscopic air gaps to maximize heat transfer. #### 4. Material and Coating (R0) * **Aluminum:** Chosen for its excellent weight-to-thermal conductivity ratio. * **Blue Anodized (R0):** The "R0" suffix indicates the finish. Anodizing protects the aluminum from corrosion and slightly increases surface emissivity, which helps with radiation cooling. --- ### Thermal Performance Table The effectiveness of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 15.31 | | 300 | 1.5 | 6.81 | | 500 | 2.5 | 4.67 | | 700 | 3.5 | 3.77 | --- ### Use Case Application This part is typically used on **Mid-sized BGA (Ball Grid Array)** components. Because it is 45mm x 45mm, it is common in: * Network switches and routers. * Industrial embedded controllers. * Power supplies requiring active or passive cooling.