The **ATS-15D-06-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance "maxiFLOW™" heat sink series, designed primarily for cooling integrated circuits (BGA packages). --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Extruded) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 7.62mm (Low Profile) | | **Thermal Resistance** | ~20.17 °C/W (Unducted @ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Design Features ### A. maxiFLOW™ Fin Geometry The "D" in the part number indicates a specific fin pattern. The maxiFLOW design features a spread fin structure which reduces pressure drop and maximizes surface area for radiant and convective cooling. This is particularly effective in environments with limited airflow. ### B. pushPIN™ Attachment Unlike adhesive tapes or simple clips, the **-R0** suffix denotes the use of the pushPIN™ mounting system. * **Precision:** Provides a consistent, calculated pressure on the component to ensure optimal thermal contact. * **Reliability:** Resistant to shock and vibration compared to thermal tape. * **Flexibility:** Comes in various lengths and spring strengths to fit different PCB thicknesses. ### C. Low Profile Design At only **7.62mm** tall, this specific model (denoted by the **-06-** code) is designed for space-constrained applications, such as 1U rack servers, blade modules, or compact networking equipment. --- ## 3. Applications This part is typically used for cooling: * **ASICs and FPGAs:** High-heat processors in telecommunications. * **BGA Components:** Large grid array chips on motherboards. * **Power Supplies:** Targeted cooling for power-management ICs. --- ## 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **15D** | Series and Fin Pattern (maxiFLOW) | | **06** | Height code (7.62mm) | | **C2** | Thermal Performance/Material Grade | | **R0** | Revision / Attachment specific (pushPIN) |