The **ATS-15D-07-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for thermal management in electronic components like CPUs, GPUs, and FPGAs. --- ### ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Part Number** | ATS-15D-07-C3-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 17.00°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | | **Fin Style** | Straight Fin | --- ### ## Key Electronic & Physical Components The performance of this heat sink is determined by its physical design and the materials used to facilitate heat transfer from electronic chips to the surrounding air. #### 1. Push-Pin Attachment Mechanism The "15D" series utilizes a brass push-pin with a stainless steel spring. This provides a consistent **7-10 lbs of pressure**, ensuring a tight interface between the chip and the heat sink, which minimizes thermal resistance. #### 2. Thermal Interface Material (TIM) The part comes pre-applied with **T412**, a high-performance Phase Change Material. * **Function:** It fills microscopic air gaps between the heat sink base and the electronic component. * **Effect:** Significantly improves heat conduction compared to dry mounting. #### 3. Fin Geometry It uses a **Straight Fin** design. In electronics, straight fins are ideal for environments with high-velocity airflow (active cooling) as they provide a low-pressure drop and allow air to flow through the channels efficiently. #### 4. Material Selection * **AL6063 Aluminum:** Offers high thermal conductivity (~200 W/m·K) while remaining lightweight and cost-effective. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer increases surface emissivity, which helps slightly with radiative heat transfer and protects the aluminum from corrosion. --- ### ## Performance Data (Airflow) The thermal efficiency depends heavily on the Linear Feet per Minute (LFM) of the airflow within the electronics enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 17.00 | | 300 (1.5 m/s) | 5.30 | | 500 (2.5 m/s) | 3.50 | | 700 (3.5 m/s) | 2.85 |