The **ATS-15D-10-C2-R0** is a specific electronic component belonging to the thermal management category. It is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance (Flowing)** | 7.89°C/W @ 100 LFM | | **Thermal Resistance (Static)** | 1.58°C/W @ 400 LFM (High airflow) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Part Number Breakdown The part number follows a specific nomenclature used by ATS to identify the component's features: - **ATS**: Advanced Thermal Solutions. - **15D**: Refers to the pushPIN™ series and heat sink geometry. - **10**: Indicates the specific fin pitch and height configuration. - **C2**: Represents the material and finish (typically Aluminum with a Blue Anodized coating). - **R0**: Refers to the revision and packaging type. --- ## 3. Key Features ### Thermal Performance Designed for high-performance cooling in tight spaces, the heat sink uses a **cross-cut fin design**. This allows for multidirectional airflow, making it more efficient than straight-fin designs in systems where the air direction might change. ### Secure Attachment The "pushPIN" system utilizes a flexible spring-loaded mechanism. This ensures: 1. **Constant Pressure:** Maintains optimal contact between the heat sink and the processor/component. 2. **Durability:** Withstands high-vibration environments better than simple adhesive tapes. 3. **Ease of Assembly:** Features pre-drilled holes for rapid installation. ### Pre-applied TIM The unit comes with **T766 thermal interface material** already applied to the base. This eliminates the need for manual thermal paste application and ensures a high-quality thermal bond right out of the box. --- ## 4. Typical Applications * **Integrated Circuits (ICs):** CPUs, GPUs, and FPGAs. * **Telecommunications:** Cooling for high-speed routers and switches. * **Power Electronics:** Voltage regulators and power transistors. * **Embedded Systems:** Industrial PCs and automation controllers.