### Overview of ATS-15D-100-C2-R0 The **ATS-15D-100-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is designed for component-level cooling in electronic assemblies. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 0.60°C/W (@ 700 LFM) | | **Base Shape** | Square | --- ### Key Electronic & Mechanical Components #### 1. Heat Sink Body (Aluminum) The core component is an extruded aluminum body. Aluminum is selected for its high thermal conductivity and lightweight properties. The fins are designed to maximize surface area for heat dissipation into the surrounding air. #### 2. Push-Pin Fasteners Unlike adhesive-based heat sinks, the **R0** designation indicates a push-pin attachment mechanism. * **Material:** Brass or Plastic pins with stainless steel springs. * **Function:** Provides consistent pressure (Pre-load) across the thermal interface material (TIM) to ensure optimal heat transfer from the electronic component (CPU, GPU, or FPGA). #### 3. Thermal Interface Material (TIM) The "C2" in the part number typically refers to the pre-applied thermal interface. * **T766 Phase Change Material:** This is usually pre-applied to the base of the heat sink to fill microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal resistance. #### 4. Blue Anodized Coating The surface is treated with a blue anodized finish. This is not just for aesthetics; it provides: * **Corrosion Resistance:** Protects the aluminum from oxidation. * **Electrical Insulation:** Provides a thin layer of non-conductive surface protection. --- ### Performance Data (Airflow) | Velocity (LFM) | Velocity (m/s) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | | 200 | 1.0 | 1.30 °C/W | | 400 | 2.0 | 0.85 °C/W | | 600 | 3.0 | 0.68 °C/W | | 700 | 3.5 | 0.60 °C/W | --- ### Application Usage This part is commonly used for cooling high-heat-generating electronic components such as: * **Microprocessors (CPUs)** * **Application-Specific Integrated Circuits (ASICs)** * **Field Programmable Gate Arrays (FPGAs)** * **Power Modules**