ATS-15D-121-C2-R0
AI

## Electronic Specifications: ATS-15D-121-C2-R0
The **ATS-15D-121-C2-R0** is a high-performance **Heat Sink** assembly designed by Advanced Thermal Solutions (ATS). It is specifically engineered for cooling electronic components such as CPUs, GPUs, or FPGAs that generate significant heat.
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### 1. General Specifications
This part belongs to the **pushPIN™** line, known for its secure and easy installation system.
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-15D-121-C2-R0 |
| **Thermal Resistance** | 9.48°C/W (Unducted Flow @ 100 LFM) |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
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### 2. Physical Dimensions
Precision in dimensions is critical for ensuring the heat sink fits within the PCB layout without interfering with surrounding components.
* **Length:** 45.00 mm
* **Width:** 45.00 mm
* **Height:** 10.00 mm (Low Profile)
* **Pitch (Fin Style):** Fine Pitch
* **Pattern:** Cross-cut
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### 3. Thermal Performance Metrics
Thermal resistance indicates how efficiently the heat sink moves heat away from the component. Lower values are better.
| Air Velocity (LFM) | 100 (0.5 m/s) | 200 (1.0 m/s) | 300 (1.5 m/s) | 400 (2.0 m/s) |
| :--- | :--- | :--- | :--- | :--- |
| **Unducted Flow (°C/W)** | 9.48 | 5.06 | 3.89 | 3.34 |
| **Ducted Flow (°C/W)** | 4.39 | 3.24 | 2.74 | 2.44 |
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### 4. Key Electronic Features
* **Thermal Interface Material (TIM):** This specific model comes pre-applied with **T766**, a high-performance thermal grease that ensures optimal heat transfer between the chip and the aluminum base.
* **Push-Pin Attachment:** The use of a brass/plastic push-pin with a stainless steel spring provides a specific, consistent pressure to the component, preventing mechanical damage while maintaining thermal contact.
* **Low Profile:** The 10mm height makes it ideal for dense electronic enclosures or 1U server racks where vertical space is limited.
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### 5. Application Code (Example)
While a heat sink is a mechanical part, engineers often use Python or Excel scripts to calculate the required thermal resistance ($R_{th}$) for their specific IC.
```python
# Simple Thermal Calculation
power_dissipation = 5.0 # Watts
max_junction_temp = 85.0 # Celsius
ambient_temp = 35.0 # Celsius
# Required Resistance = (T_junction - T_ambient) / Power
required_resistance = (max_junction_temp - ambient_temp) / power_dissipation
print(f"Required Resistance: {required_resistance} °C/W")
# Result: 10.0 °C/W.
# Since ATS-15D-121-C2-R0 is 9.48 °C/W, it is suitable for this application.
```
- ⤷What is the difference between ducted and unducted flow for this heat sink?
- ⤷ Are there alternative spring types available for the pushPIN system?
- ⤷ How does the Blue Anodized finish affect thermal radiation?