The **ATS-15D-124-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed for cooling integrated circuits (ICs) and other electronic packages. It is manufactured by Advanced Thermal Solutions (ATS). --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ Heat Sink | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance (Flowing Air)** | 1.86 °C/W @ 100 LFM | | **Thermal Resistance (Static Air)** | 3.28 °C/W | | **Attachment Method** | Push-Pin (Brass) | | **Attachment Spring** | Stainless Steel (R0 / Pre-assembled) | --- ## 2. Physical Dimensions Precision in dimensions is critical for PCB layout and ensuring there is no interference with surrounding components. | Dimension | Measurement | | :--- | :--- | | **Length (A)** | 50.00 mm | | **Width (B)** | 50.00 mm | | **Height (C)** | 25.00 mm | | **Fin Pitch** | Fine Pitch | | **Pattern** | XC-CUT (Cross-Cut) | --- ## 3. Key Electronic Design Features ### A. XC-CUT Fin Design Unlike standard straight fins, the **XC-CUT** design features cross-cut patterns. This increases the surface area and allows for multi-directional airflow, making it highly efficient in crowded PCB environments where air might not flow in a single straight path. ### B. pushPIN™ Attachment System The part utilizes the ATS **pushPIN™** system. This is a critical mechanical feature for electronics assembly: * **Pressure Management:** The springs provide a precise "force-to-load" ratio, ensuring the heat sink makes firm contact with the chip without cracking the silicon die. * **Reliability:** Brass pins with stainless steel springs offer better durability than plastic clips in high-temperature environments. ### C. Thermal Interface Material (TIM) This specific model usually comes with **T766** pre-applied thermal interface material. This eliminates the need for manual thermal paste application, reducing assembly time and ensuring a consistent thermal bond. --- ## 4. Typical Applications This component is commonly found in: * **Networking Gear:** Switches, routers, and base stations. * **Industrial Computing:** Embedded systems and PLCs. * **Power Electronics:** High-power transistors and voltage regulators.