The **ATS-15D-13-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions** | 50.00mm x 50.00mm x 15.00mm | | **Thermal Resistance** | 13.78°C/W (at 100 LFM) | | **Airflow Design** | Fine Pitch (straight fin) | --- ### 2. Breakdown of the Component Parts #### A. The Heat Sink Body The main body is made of **Aluminum 6063**, which offers a high thermal conductivity-to-weight ratio. The **15mm height** makes it a "low profile" solution, suitable for compact enclosures where vertical space is limited. #### B. The Attachment Mechanism (pushPIN™) Instead of using messy thermal adhesives or fragile clips, this part uses a **Push-Pin** system: * **Pins:** Usually made of brass or plastic. * **Springs:** Provide a "firm attachment force," ensuring consistent contact between the heat sink and the component. * **Mounting Holes:** Requires pre-drilled holes on the PCB (printed circuit board). #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heat sink comes pre-applied with **T766 thermal phase change material**. This eliminates the need for manual application of thermal paste and ensures optimal heat transfer from the chip to the aluminum fins. --- ### 3. Thermal Performance (LFM - Linear Feet per Minute) The efficiency of this heat sink depends heavily on the velocity of the air moving through the fins: | Air Velocity | Thermal Resistance (Unducted) | | :--- | :--- | | **100 LFM** | 13.78 °C/W | | **300 LFM** | 4.33 °C/W | | **500 LFM** | 2.57 °C/W | | **700 LFM** | 1.91 °C/W | --- ### 4. Summary of Application The **ATS-15D-13-C2-R0** is ideal for: * **Networking Equipment:** Routers and switches with high-density chips. * **Industrial PCs:** Where vibration resistance is needed (provided by the push-pins). * **Power Supplies:** Cooling voltage regulators or MOSFETs.