The **ATS-15D-142-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the *maxiFLOW™* series and is specifically designed for high-performance electronic cooling, such as for BGAs (Ball Grid Arrays). --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 30.00mm x 30.00mm | | **Height** | 12.70mm | | **Thermal Resistance** | 4.70°C/W @ 200 LFM | | **Regulatory** | RoHS Compliant | --- ## 2. Key Design Components ### A. Material and Coating * **Aluminum Body:** Provides high thermal conductivity for efficient heat dissipation. * **Blue Anodized Finish:** Not only provides a professional look but also increases surface emissivity, slightly improving radiation heat transfer and protecting the aluminum from corrosion. ### B. maxiFLOW™ Fin Geometry The fin design is characterized by a "tapered" profile. This specific geometry: * Reduces pressure drop across the heat sink. * Increases the surface area for air interaction. * Optimizes airflow for components that may be located in high-density PCB environments. ### C. pushPIN™ Attachment System Instead of simple adhesive tape, this model uses a mechanical **pushPIN™** system: * **Precision Springs:** Ensure the correct amount of pressure (compression) is applied to the TIM (Thermal Interface Material) for maximum heat transfer. * **Security:** It provides a much more secure attachment than adhesives, making it ideal for high-vibration environments or heavy components. --- ## 3. Thermal Performance Thermal resistance indicates how efficiently the heat sink removes heat. A lower value is better. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 LFM (1.0 m/s) | 4.70 | | 400 LFM (2.0 m/s) | 2.82 | | 600 LFM (3.0 m/s) | 2.02 | --- ## 4. Typical Applications This heat sink is commonly used for cooling: * **Processors:** Microprocessors and FPGAs. * **Networking:** High-speed routers and switches. * **Power Electronics:** Voltage regulators and high-density power modules.