The **ATS-15D-150-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **maxiFLOW™** series, designed to provide maximum surface area for cooling electronic components. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 25mm | | **Thermal Resistance** | 4.82°C/W (@ 1.0 m/s) | | **Flow Pattern** | Directional (High Performance) | --- ## 2. Key Electronic & Mechanical Features ### A. pushPIN™ Attachment System This part uses the proprietary **pushPIN™** assembly, which consists of a brass pin and a stainless steel spring. * **Benefits:** Ensures consistent pressure (clamping force) for optimal thermal interface material (TIM) performance. * **Reliability:** Re-attachable and resistant to high-vibration environments. ### B. maxiFLOW™ Fin Design The fin geometry is tapered and spread out to increase the surface area while maintaining a low pressure drop. * **Heat Dissipation:** Highly effective for high-power processors (CPUs, FPGAs, or ASICs). * **Airflow:** Designed specifically for directional airflow in server racks or dense PCB layouts. ### C. Thermal Interface Material (TIM) * **Pre-Applied:** This specific model typically comes with **T766** thermal phase-change material or grease. * **Function:** Fills microscopic air gaps between the component (chip) and the heat sink to lower thermal resistance. --- ## 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **15D** | Series/Internal Designator | | **150** | Size/Revision Identifier | | **C2** | Blue Anodized Finish | | **R0** | RoHS Compliant Version | --- ## 4. Application Use Cases 1. **High-Speed Networking:** Cooling for switches and routers. 2. **Industrial PCs:** Thermal management in enclosed, fan-cooled environments. 3. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.