The **ATS-15D-155-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blue ice" high-performance product line, designed specifically for cooling electronic components like BGA (Ball Grid Array) chips, FPGAs, and processors. --- ## 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Specification | Value / Detail | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Flow)** | 5.37°C/W @ 100 LFM | | **Thermal Resistance (Static)** | 2.50°C/W @ 500 LFM | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 20mm | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment System This is a critical feature for PCB (Printed Circuit Board) design. Instead of using messy adhesives or weak thermal tape, this part uses **brass or plastic pins with stainless steel springs**. * **Precision Pressure:** Ensures consistent contact between the heat sink and the electronic component. * **Flexibility:** Available in 9 different spring/pin combinations to match specific board thicknesses. ### B. Thermal Performance The "C2" in the part number indicates the use of high-efficiency thermal interface material (TIM). * **Alloy Composition:** The aluminum fins are spaced and tapered to maximize surface area while minimizing air pressure drop. * **Interface:** It typically comes pre-applied with a thermal pad or paste to ensure immediate heat transfer from the silicon die to the aluminum fins. ### C. Mechanical Compatibility * **Pitch:** The mounting holes are spaced at **33mm x 33mm**. * **Weight:** It is lightweight (approx. 40-60 grams depending on exact configuration), reducing mechanical stress on the PCB solder joints during vibration. --- ## 3. Applications This heat sink is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling high-speed networking switches. 2. **Industrial Controls:** Protecting PLCs and motor controllers from overheating. 3. **Computing:** Cooling chipsets on motherboards or embedded systems. ---