The **ATS-15D-166-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for cooling electronic components such as CPUs, GPUs, or power modules. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25.00 mm x 25.00 mm x 15.00 mm | | **Pitch** | 1.10 mm (approx) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 12.30° C/W @ 100 LFM | | **Spring Type** | ATS-PPS-15 | --- ### 2. Design and Engineering Features ### A. Fin Profile (Straight Fin) The device uses a **straight-fin** pattern. This design is optimized for environments where there is a consistent, directional airflow. It offers low pressure drop while maximizing the surface area available for heat dissipation. ### B. pushPIN™ Attachment System Instead of using messy thermal adhesives or simple clips, this model uses a specialized push-pin system: * **Compression Springs:** Provides precise pressure to ensure the thermal interface material (TIM) is fully engaged with the heat source. * **Hardware:** Features pre-drilled holes for secure mounting to the PCB, reducing the risk of the heat sink shifting during vibration. ### C. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates that the unit comes with **T766** thermal phase change material or similar pre-applied interface, ensuring efficient heat transfer from the electronic chip to the aluminum fins. --- ### 3. Application Use Cases This specific small-form-factor heat sink is typically found in: 1. **Network Switches:** Cooling ASICs and high-speed processors. 2. **Embedded Systems:** For industrial computers where space is limited. 3. **Power Supplies:** Managing heat in MOSFETs or voltage regulators. ---