The **ATS-15D-17-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, or high-power ASICs. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 12.70mm | | **Thermal Resistance** | 15.44°C/W (at 100 LFM) | | **Thermal Interface (TIM)** | T766 (Pre-applied Phase Change Material) | --- ## 2. Component Breakdown The part number follows a specific nomenclature used by ATS to identify its features: ### A. The Heat Sink Body * **Dimensions:** The base is a square 54mm x 54mm. The height is relatively low-profile at 12.7mm, making it suitable for compact enclosures or 1U/2U rack servers. * **Fin Design:** It typically utilizes a **cross-cut** or **pin-fin** design which allows for multi-directional airflow, making it more efficient in systems where the direction of the cooling fan may vary. ### B. Mounting System (Push-Pins & Springs) Instead of adhesive tape or screws, this part uses **plastic push-pins** and **compression springs**: * **Reliability:** Provides consistent pressure on the electronic chip, ensuring optimal heat transfer. * **Safety:** The springs prevent over-tightening which could crack the delicate silicon die of a processor. ### C. Thermal Interface Material (TIM) The "C2" designation indicates that it comes with **T766** pre-applied. * This is a "Phase Change Material" that is solid at room temperature but softens and flows into the microscopic gaps between the chip and the heat sink once the component heats up. --- ## 3. Applications This part is commonly used in the following electronic environments: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Computing:** Industrial PC boards and single-board computers (SBCs). 3. **Power Electronics:** Cooling MOSFET arrays or power modules. ---