ATS-15D-191-C2-R0
AI

The **ATS-15D-191-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs.
---
### 1. Technical Specifications
Below are the primary electronic and physical specifications for this part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Part Number** | ATS-15D-191-C2-R0 |
| **Type** | Top Mount Heat Sink |
| **Thermal Resistance** | 2.90°C/W (at 200 LFM) |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | Push-Pin (Brass/Plastic) |
| **Fin Style** | Straight Fin |
| **Thermal Interface Material** | T766 (Pre-applied) |
---
### 2. Key Electronic Components & Features
#### A. Thermal Interface Material (TIM)
The "C2" in the part number indicates the use of **T766 phase-change material**.
- **Function:** This is a thin layer applied to the bottom of the heat sink.
- **Electronic Impact:** It fills microscopic air gaps between the semiconductor die and the aluminum base, significantly reducing thermal impedance and preventing the electronic component from thermal throttling or failure.
#### B. Push-Pin Attachment Mechanism
Instead of using messy adhesives or complex clips, this part uses a mechanical push-pin system.
- **Material:** Usually features a brass or plastic pin with a high-tension steel spring.
- **Electronic Impact:** It provides consistent downward pressure (clamping force), which ensures stable thermal contact over the lifespan of the PCB, even under vibration.
#### C. Straight Fin Design
The fins are arranged in a straight-line configuration.
- **Airflow:** Optimized for "Longitudinal" airflow (where air moves along the length of the fins).
- **Efficiency:** This design is ideal for high-density electronic enclosures where forced air (fans) is present.
---
### 3. Dimensions & Mounting
Precise dimensions are critical for PCB layout and avoiding interference with nearby capacitors or resistors.
| Dimension | Value |
| :--- | :--- |
| **Length/Width** | 45mm x 45mm |
| **Height** | 30mm |
| **Pitch** | 38mm (hole-to-hole) |
---
### 4. Part Number Decoder
Understanding the "ATS" nomenclature:
- **ATS-15**: Series (Push-pin heat sink).
- **D**: Material/Spring force indicator.
- **191**: Specific geometry/fin configuration.
- **C2**: Thermal Interface Material (T766).
- **R0**: RoHS compliance (Lead-free).
- ⤷
How does the T766 interface material compare to standard thermal grease?
- ⤷ What are the PCB hole size requirements for the push-pin mounting?
- ⤷ Can this heat sink be used for passive cooling without a fan?