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  • ATS-15D-191-C2-R0

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    The **ATS-15D-191-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary electronic and physical specifications for this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-15D-191-C2-R0 | | **Type** | Top Mount Heat Sink | | **Thermal Resistance** | 2.90°C/W (at 200 LFM) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass/Plastic) | | **Fin Style** | Straight Fin | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Electronic Components & Features #### A. Thermal Interface Material (TIM) The "C2" in the part number indicates the use of **T766 phase-change material**. - **Function:** This is a thin layer applied to the bottom of the heat sink. - **Electronic Impact:** It fills microscopic air gaps between the semiconductor die and the aluminum base, significantly reducing thermal impedance and preventing the electronic component from thermal throttling or failure. #### B. Push-Pin Attachment Mechanism Instead of using messy adhesives or complex clips, this part uses a mechanical push-pin system. - **Material:** Usually features a brass or plastic pin with a high-tension steel spring. - **Electronic Impact:** It provides consistent downward pressure (clamping force), which ensures stable thermal contact over the lifespan of the PCB, even under vibration. #### C. Straight Fin Design The fins are arranged in a straight-line configuration. - **Airflow:** Optimized for "Longitudinal" airflow (where air moves along the length of the fins). - **Efficiency:** This design is ideal for high-density electronic enclosures where forced air (fans) is present. --- ### 3. Dimensions & Mounting Precise dimensions are critical for PCB layout and avoiding interference with nearby capacitors or resistors. | Dimension | Value | | :--- | :--- | | **Length/Width** | 45mm x 45mm | | **Height** | 30mm | | **Pitch** | 38mm (hole-to-hole) | --- ### 4. Part Number Decoder Understanding the "ATS" nomenclature: - **ATS-15**: Series (Push-pin heat sink). - **D**: Material/Spring force indicator. - **191**: Specific geometry/fin configuration. - **C2**: Thermal Interface Material (T766). - **R0**: RoHS compliance (Lead-free).
    ✨ Follow-up Questions
    • ⤷ How does the T766 interface material compare to standard thermal grease?
    • ⤷ What are the PCB hole size requirements for the push-pin mounting?
    • ⤷ Can this heat sink be used for passive cooling without a fan?