The **ATS-15D-192-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. These parts are critical for maintaining the operational temperature of integrated circuits (ICs), CPUs, and GPUs. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Below are the primary specifications for this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 2.35°C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Spring Type** | Compression Spring | | **Dimensions** | 45mm x 45mm x 30mm | | **Thermal Interface** | T766 (Pre-applied Phase Change Material) | --- ### 2. Physical Design & Features #### Fin Profile: Straight Fin This model uses a **Straight Fin** design. This is optimized for high-performance cooling in environments where there is a consistent, directed airflow (longitudinal flow). #### Attachment Mechanism: Push-Pin The "15D" series utilizes a push-pin and spring system. This is preferred in manufacturing because: * It provides **consistent pressure**, ensuring the thermal interface material (TIM) performs optimally. * It reduces the risk of mechanical stress on the PCB compared to adhesive tapes. * The pins come in various materials (Plastic or Brass) to match the weight and environment requirements. #### Thermal Interface Material (TIM) The **C2** suffix indicates that the part comes with **T766** pre-applied. This is a high-performance phase-change material that melts at operating temperatures to fill microscopic air gaps between the heat sink and the component, significantly lowering thermal resistance. --- ### 3. Electronic Application This heat sink is typically found in the following electronic sectors: 1. **Telecommunications:** Cooling high-speed processors in routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Data Centers:** Low-profile server components where vertical space is limited to 30mm. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 4.39 | | 200 (1.0 m/s) | 2.35 | | 400 (2.0 m/s) | 1.49 | | 600 (3.0 m/s) | 1.13 | ---