The **ATS-15D-202-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blue ICE" series designed specifically for cooling electronic components such as processors, BGA (Ball Grid Array) packages, and power modules. --- ## 1. Technical Specifications The part number encodes specific mechanical and thermal properties. Here is a breakdown of its core specifications: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 15mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | ~1.48 °C/W (at 200 LFM) | | **Airflow Direction** | Vertical (Cross-Cut for omni-directional flow) | --- ## 2. Key Electronic & Mechanical Features ### A. Material and Coating * **Aluminum 6063:** Provides a high thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** The surface treatment is not just aesthetic; it increases **emissivity**, enhancing heat radiation, and provides corrosion/electrical insulation for the aluminum body. ### B. Fin Geometry (Cross-Cut) The unit features a **straight fin, cross-cut** design. Unlike longitudinal fins that require airflow from a specific direction, cross-cut fins allow for **omni-directional airflow**. This is critical in dense electronic enclosures where airflow direction may be turbulent or unpredictable. ### C. Attachment System: Push-Pins The "R0" suffix indicates the inclusion of a specific mounting kit: * **Push-Pins:** Plastic pins with integrated springs provide a consistent pressure (Force) against the electronic component. * **Thermal Interface Material (TIM):** This model typically comes pre-applied with **ATS-51**, a high-performance thermal grease, ensuring minimum air gaps between the component and the heat sink. --- ## 3. Performance Summary The efficiency of this heat sink depends on the velocity of the air (Linear Feet per Minute - LFM) moving through the system: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 1.48 | | **300 (1.5 m/s)** | 1.15 | | **500 (2.5 m/s)** | 0.90 | --- ## 4. Typical Applications * **Telecommunications:** Cooling of high-speed networking chips. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Dissipating heat from MOSFET arrays or Voltage Regulator Modules (VRMs).