## Technical Overview: ATS-15D-207-C2-R0 The **ATS-15D-207-C2-R0** is a high-performance **Heat Sink** assembly designed by Advanced Thermal Solutions (ATS). It is specifically engineered for cooling electronic components like CPUs, GPUs, and FPGAs that require efficient heat dissipation in constrained spaces. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Body), Copper (Thermal Interface) | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions** | 60.00mm x 60.00mm | | **Height** | 12.00mm | | **Thermal Resistance** | 6.39°C/W (Unducted Flow @ 100 LFM) | | **Finish** | Blue Anodized | --- ### 2. Component Features #### A. pushPIN™ Design The "15D" series utilizes a proprietary push-pin attachment mechanism. This allows for: * **Uniform Pressure:** Ensures consistent contact between the heat sink base and the electronic component. * **Ease of Installation:** No specialized tools are required for mounting, reducing assembly time. * **Reliability:** The springs (available in brass or plastic) provide a secure hold even under mechanical vibration. #### B. High-Performance Fin Geometry The fin design is optimized for **cross-cut airflow**. This means it can capture air from multiple directions, making it ideal for systems where the airflow direction might be obstructed or turbulent. #### C. Thermal Interface Material (TIM) The "C2" suffix typically denotes the inclusion of a **T766 phase-change material** or a high-performance thermal pad pre-applied to the base. This eliminates the need for manual thermal paste application, ensuring a clean and efficient thermal bridge. --- ### 3. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.39 | | 200 (1.0 m/s) | 4.48 | | 300 (1.5 m/s) | 3.70 | | 400 (2.0 m/s) | 3.24 | --- ### 4. Typical Applications * **Telecommunications:** Cooling of networking switches and routers. * **Industrial PC:** Cooling processors in fanless or low-airflow enclosures. * **Power Electronics:** Dissipating heat from high-wattage voltage regulators. ---