The **ATS-15D-210-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for the thermal management of electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Dimensions (L x W x H)** | 70.00 mm x 70.00 mm x 6.00 mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Unducted)** | 5.18 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.21 °C/W @ 100 LFM | | **Fin Pitch** | Fine-Pitch | | **Fin Pattern** | XC-CUT | --- ### 2. Key Electronic Features * **Thermal Management:** The primary role of this part is to dissipate heat from integrated circuits (ICs). By increasing the surface area, it prevents thermal throttling and hardware failure. * **XC-CUT Pattern:** The "XC-CUT" design features a cross-cut fin geometry. This creates more turbulence in the airflow, which significantly improves heat transfer compared to straight-fin designs in low-airflow environments. * **PushPIN™ Mounting:** This part utilizes a specialized mounting system consisting of a brass or plastic pin and a high-performance compression spring. This ensures: * **Consistent Pressure:** Maintains even contact between the heat sink and the chip. * **Vibration Resistance:** Ideal for industrial or automotive electronics. * **Blue Anodized Finish:** Beyond aesthetics, the anodization protects the aluminum from corrosion and slightly improves thermal emissivity. --- ### 3. Part Number Breakdown The part number follows a specific nomenclature used by Advanced Thermal Solutions: | Segment | Meaning | | :--- | :--- | | **ATS-15** | Series identification | | **D** | Attachment type (PushPIN) | | **210** | Specific geometry/size code | | **C2** | Thermal Performance/Material grade | | **R0** | RoHS compliant / Revision | --- ### 4. Application Use-Case This specific model is a **low-profile** heat sink (only 6mm high). It is typically used in: * **1U Servers:** Where vertical space is extremely limited. * **Embedded Systems:** For cooling SoCs (System on Chips). * **Networking Gear:** Cooling high-speed switches or routers.