The **ATS-15D-22-C2-R0** is a specific electronic cooling component, categorized as a high-performance **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "blue ice" or high-efficiency push-pin series. --- ## 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Below is a detailed breakdown of its specifications: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Category** | Thermal Management - Heat Sinks | | **Attachment Method** | Push-Pin (2-Pin) | | **Thermal Resistance** | 13.83°C/W (at 200 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 60mm x 60mm x 12.7mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Electronic Components Breakdown ### A. The Heat Sink Body (Fin Design) The "22" in the part number indicates a specific fin pattern. The ATS-15D-22 uses a **Straight Fin** design. * **Function:** It maximizes surface area to allow heat generated by a semiconductor (like a CPU, FPGA, or MOSFET) to dissipate into the surrounding air. * **Material:** It is made of Aluminum 6063, which offers a balance between thermal conductivity and weight. ### B. The Push-Pin Attachment Instead of using messy adhesives or permanent solder, this part uses a mechanical **Push-Pin** system with a compression spring. * **Reliability:** Ensures consistent pressure between the heat sink and the electronic component, which is vital for thermal transfer. * **Plastic/Brass Pins:** The "D" in the part number usually specifies the pin material (e.g., Plastic or Brass), designed to fit into 3.0mm holes on a PCB. ### C. Thermal Interface Material (TIM) The "R0" suffix indicates that the unit comes with a pre-applied **T766 Phase Change Material**. * **Purpose:** It fills microscopic air gaps between the component and the heat sink. * **Advantage:** Eliminates the need for manually applying thermal paste during assembly. --- ## 3. Application Use Cases This specific part is typically used in medium-to-high power electronic environments where space is limited but cooling is critical: 1. **Telecommunications:** Cooling of high-speed processors in networking switches. 2. **Industrial Controls:** Managing heat in motor controllers and PLCs. 3. **Power Electronics:** Dissipating heat from high-wattage power supplies. ---