## Technical Overview: ATS-15D-25-C2-R0 The **ATS-15D-25-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components like CPUs, GPUs, and FPGAs that require high thermal efficiency in constrained airflows. --- ### 1. Part Number Breakdown Understanding the nomenclature helps identify the physical and thermal properties of the component: | Code Segment | Meaning | Specification | | :--- | :--- | :--- | | **ATS** | Manufacturer | Advanced Thermal Solutions | | **15D** | Attachment Type | push-PIN™ | | **25** | Dimension (Width) | 45.00 mm (Approx. based on series) | | **C2** | Thermal Interface | T766 (High Performance Phase Change) | | **R0** | RoHS Status | Compliant / Revision 0 | --- ### 2. Core Specifications This part is engineered for high-density electronic assemblies. Below are the primary mechanical and thermal characteristics: * **Dimensions:** 45.00mm x 45.00mm (Base) * **Height:** 25.00 mm * **Material:** Aluminum 6063 * **Finish:** Blue Anodized * **Attachment Method:** push-PIN™ with a specialized brass spring and plastic pin. * **Fin Style:** Straight (High-performance maxiFLOW™ profile). --- ### 3. Thermal Performance Data Thermal resistance is measured in °C/W (Degrees Celsius per Watt). Lower values indicate better cooling performance. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) - Unducted | | :--- | :--- | | 200 (1.0 m/s) | 6.26 | | 400 (2.0 m/s) | 3.17 | | 600 (3.0 m/s) | 2.15 | | 800 (4.0 m/s) | 1.84 | --- ### 4. Key Electronic Applications This specific heat sink is typically used in the following electronic environments: 1. **Networking & Telecom:** Switches and routers where airflow is directional. 2. **Power Electronics:** Cooling MOSFETs or IGBT modules. 3. **Embedded Computing:** High-speed processors in industrial PCs. 4. **Field Programmable Gate Arrays (FPGAs):** Providing thermal stability for high-gate-count chips. ### 5. Attachment Mechanism The **push-PIN™** system used in the ATS-15D-25-C2-R0 ensures: * **High Pressure:** Provides consistent contact between the heat sink and the chip. * **Tool-less Installation:** Allows for quick assembly on PCBs with pre-drilled holes. * **Vibration Resistance:** The compression springs handle mechanical stress better than simple adhesive tapes. ---