The **ATS-15D-27-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, or GPUs. Below is a breakdown of its technical specifications and features. --- ### 1. General Specifications | Feature | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-15D-27-C2-R0 | | **Component Type** | Heat Sink | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | --- ### 2. Physical Dimensions This model is part of the **maxiFLOW™** line, known for its unique flared fin geometry which maximizes surface area for air convection. * **Length:** 70.00 mm * **Width:** 70.00 mm * **Height (Fin Depth):** 12.70 mm * **Pitch (Hole Spacing):** 63.00 mm (center-to-center for mounting) --- ### 3. Thermal Performance The performance of a heat sink is measured by its **Thermal Resistance**. Lower values indicate better cooling efficiency. | Airflow Velocity | Thermal Resistance (Unducted) | Thermal Resistance (Ducted) | | :--- | :--- | :--- | | **@ 1.0 m/s (200 LFM)** | 12.24 °C/W | 1.77 °C/W | | **@ 2.0 m/s (400 LFM)** | 5.84 °C/W | 1.25 °C/W | | **@ 3.0 m/s (600 LFM)** | 3.56 °C/W | 1.06 °C/W | --- ### 4. Key Electronic/Mechanical Features * **pushPIN™ Mounting:** This part utilizes a specialized spring-loaded pin mechanism. It ensures consistent pressure (clamping force) on the electronic chip, which improves thermal transfer and prevents the heat sink from shifting during vibration. * **Pre-Applied Thermal Interface Material (TIM):** The "R0" designation typically indicates that the part comes with a pre-applied high-performance thermal pad or grease (specifically **T766**), simplifying the assembly process. * **Material Science:** Made from **AL-6063**, an aluminum alloy frequently used for extrusions due to its excellent thermal conductivity and structural integrity. * **Compliance:** The part is **RoHS and REACH compliant**, meeting environmental safety standards for electronic manufacturing. --- ### 5. Application Use-Case This component is typically found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Cooling MOSFETs or power modules where vertical space is limited (due to its low 12.7mm profile).