The **ATS-15D-33-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs in high-airflow environments. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 17.42°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 17.78mm | | **Fin Style** | Straight Fin | --- ### 2. Component Breakdown #### A. The Heat Sink Body * **Aluminum Construction:** Offers a balance of high thermal conductivity and light weight. * **Blue Anodized Finish:** Not only provides aesthetic value but also increases surface emissivity (improving radiation heat transfer) and protects the metal from corrosion. * **Fin Geometry:** Uses a high-performance "straight fin" design, which is optimized for **forced convection** (airflow from a fan). #### B. Mechanical Attachment (The Push-Pin) * **Tool-less Installation:** The "Push-Pin" mechanism allows for quick assembly. The pins are pushed through pre-drilled holes in the Printed Circuit Board (PCB). * **Compression Spring:** A brass or steel spring provides consistent downward pressure on the electronic chip, ensuring a tight interface between the heat sink and the component. #### C. Thermal Interface Material (TIM) * **Pre-Applied Material:** This model typically comes with **T766** thermal phase-change material or a similar pad pre-applied to the base. This fills microscopic air gaps between the chip and the heat sink to maximize heat transfer. --- ### 3. Application Use Cases This specific part is frequently found in: 1. **Telecommunications:** Networking switches and routers. 2. **Industrial PC (IPC):** Embedded systems requiring passive cooling under chassis airflow. 3. **Power Supplies:** Cooling voltage regulators or power transistors. --- ### 4. Thermal Performance Data Performance varies based on Airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 17.42 | | 400 (2.0 m/s) | 7.67 | | 600 (3.0 m/s) | 5.33 | | 800 (4.0 m/s) | 4.41 |