ATS-15D-34-C2-R0
AI

The **ATS-15D-34-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their **blueICE™** high-performance heat sink series, designed primarily for cooling BGA (Ball Grid Array) components.
---
## 1. Technical Specifications
The part number encodes specific physical and material properties. Here is the breakdown:
| Parameter | Specification |
| :--- | :--- |
| **Component Type** | Heat Sink |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W)** | 45mm x 45mm |
| **Height** | 25mm |
| **Material** | Aluminum (6063-T5) |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | 0.67 °C/W (at 600 LFM) |
| **Finish** | Blue Anodized |
---
## 2. Key Electronic & Physical Features
### A. pushPIN™ Attachment System
The "C2" in the part number indicates a specific attachment kit. This system replaces traditional adhesive tapes with a mechanical fastener:
* **Precision Springs:** Provides consistent pressure to ensure optimal thermal interface material (TIM) contact.
* **Pre-drilled Holes:** Designed to fit specific PCB hole patterns to prevent component shifting.
### B. Material and Thermal Conductivity
* **Aluminum 6063-T5:** Offers high thermal conductivity while remaining lightweight, which is crucial for preventing PCB stress.
* **Blue Anodized Coating:** This is not just aesthetic; the anodization increases surface emissivity and provides corrosion resistance and electrical insulation.
### C. Thermal Performance (Flow Rate)
The effectiveness of this part depends on the airflow (measured in Linear Feet per Minute - LFM):
* **Low Flow (200 LFM):** ~1.75 °C/W
* **High Flow (800 LFM):** ~0.60 °C/W
---
## 3. Applications
This part is commonly used in high-heat density electronic environments:
1. **Networking Hardware:** Switches, routers, and high-speed modems.
2. **Embedded Systems:** Industrial PCs and controllers.
3. **Telecommunications:** Base station power modules.
---
## 4. Part Number Breakdown
```text
ATS - 15 D - 34 - C2 - R0
| | | | |
| | | | +-- Revision Code
| | | +------- Attachment & TIM Kit (pushPIN™)
| | +------------ Height / Fin Configuration
| +----------------- Fin Pitch/Style
+----------------------- Advanced Thermal Solutions (Manufacturer)
```
- ⤷
What are the PCB hole requirements for the pushPIN™ attachment on this model?
- ⤷ How does the 'Blue Anodized' finish compare to 'Black Anodized' in terms of thermal performance?
- ⤷ Is this heat sink compatible with standard 45mm BGA components from other manufacturers?