The **ATS-15D-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for precision cooling of electronic components like CPUs, GPUs, and power modules. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Series** | pushPIN™ | | **Heat Sink Type** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic) | | **Material** | Aluminum (AL6063) | | **Dimensions (L x W)** | 35mm x 35mm | | **Height** | 10mm | | **Finish** | Blue Anodized | | **Thermal Resistance** | 22.48 °C/W (Unducted @ 100 LFM) | --- ### Key Electronic Components & Features #### 1. Push-Pin Attachment Mechanism Unlike adhesive-based heat sinks, the **C2-R0** uses a mechanical push-pin system. - **Springs:** Includes a pre-assembled tension-controlled spring (typically brass or stainless steel) to ensure uniform pressure across the component surface. - **Reliability:** Prevents the heat sink from shifting during vibration or shipping, which is critical for long-term electronic stability. #### 2. Material and Conductivity - **Aluminum 6063:** This specific alloy is chosen for its excellent thermal conductivity and lightweight properties. - **Blue Anodized Finish:** This is not just for aesthetics; the anodization process increases surface emissivity, slightly improving radiation heat transfer and providing a protective layer against corrosion. #### 3. Straight Fin Design The "Straight Fin" geometry is optimized for **forced-air cooling** (fan-driven). The fins are precisely spaced to allow airflow to pass through with minimal pressure drop while maximizing the surface area available for heat dissipation. #### 4. Thermal Interface Material (TIM) The "R0" designation usually indicates that the heat sink comes with a **pre-applied Thermal Interface Material**. This material fills the microscopic air gaps between the heat sink base and the electronic chip, significantly reducing thermal resistance. --- ### Performance Data (Thermal Resistance) The efficiency of this part depends on the airflow (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Unducted (°C/W)** | 22.48 | 6.62 | 3.82 | 2.82 | | **Ducted (°C/W)** | 4.34 | 2.30 | 1.84 | 1.62 | --- ### Application Usage This part is commonly found in: * **Networking Hardware:** Routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators.