The **ATS-15D-47-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling integrated circuits (ICs) and other PCB components. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 25mm x 25mm x 30mm (LxWxH) | | **Thermal Resistance** | 9.30°C/W (at 200 LFM) | | **Attachment Method** | Push Pin (Brass) | | **Pressure Spring** | Stainless Steel | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Electronic Components & Features #### 1. Heat Sink Body (Extrusion) The core of the part is a high-aspect-ratio aluminum extrusion. The vertical fins provide a large surface area relative to its 25mm base, which is critical for dissipating heat from small chips into the surrounding air. #### 2. Push Pin Attachment Unlike adhesive-based heat sinks, the "15D" series uses a mechanical **push pin** system. * **Spring-Loaded:** Provides consistent pressure on the processor, ensuring optimal contact with the Thermal Interface Material. * **Reliability:** Mechanical mounting is preferred in high-vibration environments or for components that generate significant heat (which can weaken adhesives). #### 3. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. * **Purpose:** This material fills microscopic air gaps between the heat sink surface and the electronic chip, significantly reducing thermal resistance. #### 4. Blue Anodized Coating The blue anodization is not just for aesthetics; it provides: * **Corrosion Resistance:** Protects the aluminum from oxidation. * **Electrical Insulation:** Provides a thin layer of non-conductive protection (though not to be relied upon for high-voltage isolation). * **Thermal Emissivity:** Improves heat radiation compared to polished aluminum. --- ### Performance Data The cooling efficiency depends on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Unducted)** | 11.57 | | **200 (Unducted)** | 9.30 | | **300 (Unducted)** | 7.97 | --- ### Typical Applications This specific size and mounting style are commonly found in: * **Networking Equipment:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or small voltage regulators.